KR19980025749A - Printed Circuit Board Printing Method - Google Patents

Abstract

The present invention relates to a method of printing a printed circuit board, by which the first insulating layer and the second insulating layer are printed in different directions, thereby improving the poor insulation due to unprinting.

The present invention provides a method of printing a printed circuit board for insulating a pattern formed on a substrate, the method comprising: printing a first insulating layer onto a substrate including the pattern and a direction different from printing the first insulating layer; And printing the second insulating layer to print the second insulating layer.

Therefore, according to the present invention, it is possible to prevent insulation defects due to unprinting of the insulation layer, thereby maximizing the productivity and reliability of the product.

Description

Printed Circuit Board Printing Method

The present invention relates to a method of printing a printed circuit board, and more particularly, to a method of printing a printed circuit board which improves insulation failure due to unprinting by printing the first insulating layer and the second insulating layer in different directions. It is about.

In general, a printed circuit board (PCB) laminates a copper plate on a substrate made of a material such as paper-phenol resin or glass epoxy resin, and prints and etches patterns. ), A copper foil for wiring is completed into a figure.

Recently, printed circuit boards are becoming thin and light in order to mount components with high integration due to the development of electronic technology, and printed circuit boards are becoming more important as a basic element to increase the degree of integration.

Therefore, printed circuit boards require sophisticated patterns, and in order to connect these patterns suitably for circuit design, a jump circuit or the like is formed by using a conductive paste to increase the degree of integration.

1 (a) to (c) are sectional views showing a printing method of a conventional printed circuit board.

First, in FIG. 1A, a pattern 12 and a solder resist 14, which is a first insulating layer, are formed on a substrate 10. In FIG. An under coat 16 serving as a second insulating layer is shown in Fig. 1 (C) in which the conductive paste 18 is formed on Fig. 1 (B).

In the manufacture of a printed circuit board including a conventional jumper circuit, first, Figure 1 (a) shows a solder resist 14 which prevents lead from adhering to the substrate 10 on which the pattern 12 is formed and also serves as an insulating role. Print).

1 (b) prints the undercoat 16 on the substrate 10 on which the solder resist 14 is printed.

Subsequently, Figure 1 (C) print-forms the conductive paste 18 which serves as a jumper circuit.

However, conventionally, since printing is performed in one direction, that is, in the same direction when the solder resist 14 and the undercoat 16 are printed, one side wall of the portion where the pattern 12 is formed at a predetermined height is completely insulated ( 14, 16) failed to print.

As a result, an insulation failure such as a short occurs in a portion where the pattern 12 is exposed due to the unprinting of the conductive paste 18 and the insulating layers 14 and 16 printed on the insulating layers 14 and 16. Causing serious problems.

Therefore, conventionally, there is a problem of poor insulation due to unprinting of the insulating layer insulating the pattern and the conductive paste, thereby lowering the productivity and reliability of the product.

An object of the present invention is to provide a printing method of a printed circuit board for preventing the above-mentioned problems due to poor insulation by preventing the unprinted when printing the insulating layer.

1 (a) to (c) are sectional views showing a printing method of a conventional printed circuit board.

2 (a) to (d) are sectional views showing one embodiment of a method of printing a printed circuit board according to the present invention.

※ Explanation of symbols for main parts of drawing

10, 20: substrate 12, 22: pattern

14, 24: solder resist 16, 26: undercoat

18, 28: conductive paste

A printed circuit board printing method according to the present invention for achieving the above object, in a printing method of a printed circuit board for insulating a pattern formed on the substrate, the first insulating layer on the substrate comprising the pattern And printing the second insulating layer so that the second insulating layer is printed in a direction different from the printing of the first insulating layer.

In addition, it is preferable that the conductive paste printing step is further included on the substrate on which the second insulating layer is formed.

The second insulating layer printed in a direction different from the printing of the first insulating layer may be printed after rotating the substrate by 180 ° after printing the first insulating layer or printing the first insulating layer in one direction. After that, it is preferable to print in a direction opposite to the printing of the first insulating layer.

Here, it is preferable that the first insulating layer is solder resist printing, and the second insulating layer is undercoat printing.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 (a) to (d) are sectional views showing one embodiment of a method of printing a printed circuit board according to the present invention.

Here, after printing the first insulating layer, the method of printing the second insulating layer by rotating the substrate by 180 ° is described as the first embodiment, and the printing of the first insulating layer and the second insulating layer is performed in the opposite direction. A method of making this a second embodiment.

First, a pattern 22 and a solder resist 24 serving as a first insulating layer are printed on the substrates 20 (a) and (b), and FIGS. (B) The undercoat 26 which is a 2nd insulating layer is the structure by which the electrically conductive paste 28 is formed on FIG. 2 (d).

In the first embodiment, first, a solder resist 24 is printed on a substrate 20 on which a pattern 22 serving as an electrical wiring is printed in FIG.

In the present invention, the solder resist 24 not only serves to prevent lead from being buried in the pattern 22 formed of copper foil during soldering, but also insulates the pattern 22.

Subsequently, Figure 2 (b) rotates the substrate 20 by 180 degrees, and Figure 2 (c) prints the undercoat 26 for insulation on the substrate 20 rotated by 180 degrees.

According to the embodiment, the printing of the solder resist 24, which is the first insulating layer, and the undercoat 26, which is the second insulating layer, is printed in opposite directions, and after printing the solder resist 24, the substrate 20 is 180. When the undercoat 26 is printed by rotating it, the solder resist 24 and the undercoat 26 are printed in different directions even in the same printing direction.

The printing of the first insulating layer and the second insulating layer may be performed by making a screen suitable for a circuit design and performing a process, which can be understood by those skilled in the art.

Subsequently, the conductive paste 28 serving as a jumper circuit may be printed and formed in FIG.

According to the present invention, the printing of the solder resist 24 and the undercoat 26, which are print-formed to insulate the pattern 22 and the conductive paste 28, is printed in different directions so that the pattern 22 is printed at a predetermined height. Insulation failure due to unprinting of the formed side wall can be prevented.

The second embodiment prints a solder resist as the first insulating layer and then prints the undercoat as the second insulating layer in the opposite direction in which the solder resist as the first insulating layer is printed.

That is, if the first insulating layer is printed from the left direction to the right direction, the second insulating layer is printing from the right direction to the left direction.

This makes it possible to print with the same insulating layer as in the first embodiment, thereby perfecting the insulating role with the conductive paste printed thereon.

The second embodiment may also be understood by those skilled in the art that the screen of the first insulating layer and the second insulating layer may be manufactured to be suitable for the circuit design and the printing process may be performed.

That is, the present invention can prevent a defect due to unprinting of the insulating layer to be printed by changing the direction in which the insulating layer is printed.

Therefore, according to the present invention, it is possible to prevent insulation defects due to unprinting of the insulation layer, thereby maximizing the productivity and reliability of the product.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (5)

In the printing method of a printed circuit board for insulating the pattern formed on the substrate, Printing a first insulating layer onto the substrate including the pattern; And Printing the second insulating layer such that the second insulating layer is printed in a direction different from the printing of the first insulating layer; Print method of a printed circuit board comprising a. The method of claim 1, And printing a conductive paste on the substrate on which the second insulating layer is to be printed. The method of claim 1, And the second insulating layer printed in a direction different from the printing of the first insulating layer is printed after rotating the substrate by 180 ° after printing the first insulating layer. The method of claim 1, The printed circuit board, wherein the second insulating layer printed in a different direction from the first insulating layer printing is printed in a direction opposite to the printing of the first insulating layer after printing the first insulating layer in one direction. Of printing method. The method according to claim 1, 3 or 4, And the first insulating layer is solder resist printing, and the second insulating layer is undercoat printing.