KR0186084B1 - 히팅장치를 구비한 웨지 공구 - Google Patents

히팅장치를 구비한 웨지 공구 Download PDF

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KR0186084B1
KR0186084B1 KR1019950028689A KR19950028689A KR0186084B1 KR 0186084 B1 KR0186084 B1 KR 0186084B1 KR 1019950028689 A KR1019950028689 A KR 1019950028689A KR 19950028689 A KR19950028689 A KR 19950028689A KR 0186084 B1 KR0186084 B1 KR 0186084B1
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South Korea
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wedge tool
wire
wedge
present
tool
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KR1019950028689A
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English (en)
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조재원
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문정환
엘지반도체주식회사
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Priority to KR1019950028689A priority Critical patent/KR0186084B1/ko
Priority to US08/589,678 priority patent/US5958270A/en
Priority to JP8012760A priority patent/JP2741496B2/ja
Priority to CN96109498A priority patent/CN1083157C/zh
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Publication of KR0186084B1 publication Critical patent/KR0186084B1/ko

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
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Abstract

본 발명은 히팅장치를 구비한 웨지 툴에 관한 것이다. 본 발명의 웨지 툴은 그 소정부위에 열선을 구비한 금속봉이나 도전성 와이어 또는 박막형태의 열판을 설치하고, 금속봉, 도전성 와이어 및 열판에 각기 파워공급수단을 거쳐서 전원을 공급함에 의해 와이어 본딩공정시 웨지 툴에 열을 공급하고자 하는 것이다. 이와 같이 구성된 웨지 툴은 열을 발생시키는 히팅시스템을 구비하므로 양호한 본딩력을 얻을 수 있다.

Description

히팅장치를 구비한 웨지 공구
제1도는 종래의 세라믹 패키지를 웨지 툴에 의해 와이어 본딩하는 상태를 나타낸 단면도.
제2도는 종래의 웨지 툴의 개략적인 단면도.
제3도의 (a)는 본 발명의 일실시예에 따른 웨지 툴을 나타낸 단면도.
제3도의 (b)는 본 발명의 웨지 툴의 하부 즉, 제3도(a)의 A 부분을 절결확대하여 나타낸 사시도.
제4도는 본 발명의 다른 실시예에 따른 웨지 툴을 나타낸 단면도.
제5도는 본 발명의 또 다른 실시예에 따른 웨지 툴을 나타낸 단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 반도체 칩 3 : 리드 베이스
4, 14 : 웨지 툴 5 : 인너 리드
10 : 세라믹 패키지 15 : 삽입구멍
16 : 열선 17 : 금속봉
20 : 홈 23 : 도전성 와이어
26 : 와이어 29 : 열판
본 발명은 반도체 장치에 관한 것으로, 특히 와이어 본딩시, 히팅장치를 이용하여 양호한 본딩력을 얻을 수 있는 히팅장치를 구비한 웨지공구에 관한 것이다.
종래의 세라믹형 반도체 패키지는 제1도에 도시된 바와 같이, 반도체 칩(1)과, 상기 반도체 칩(1)을 수용하기 위한 공동(2) 리드 베이스(3)와, 상기 공동(2)을 밀봉 시키기 위한 금속캡(도시되지 않음)으로 구성되어 있다.
일반적으로, 상기 세라믹형 반도체 패키지는 반도체 칩(1)을 리드베이스(2)에 안착시키는 다이/어태치(Die/Attaching) 공정 후, 와이어 본딩(Wire Bonding) 공정을 수행하게 된다. 이때, 웨지 툴(Wedge Tool)(4)에 알루미늄 와이어(AL wire)(6) 끼운 후, 반도체 칩(1) 상의 소정부위에 형성된 단자(또는 패드라고 함;)와 세라믹 패키지(10)의 인너리드(5)를 웨지 장비(도시되지 않음)로부터 상기 웨지 툴(4)로 전달된 초음파 및 기계적 압력에 의해 와이어 본딩작업을 수행하게 된다.
그러나, 상기 웨지 툴은 제2도에 도시된 바와 같이, 와이어 본딩공정에서 어떠한 히팅장치없이 단지 초음파 및 기계적 압력에 의해서 와이어 본딩을 수행하게 되므로 본딩력이 저하되는 단점이 있다. 즉, 알루미늄 와이어(6)를 기계적인 압력에 의해서만 접합하게 되므로 신뢰성이 저하된다.
따라서, 본 발명의 목적은 웨지 툴에 열을 제공할 수 있는 히팅장치를 구비한 웨지 툴을 제공함에 있다.
본 발명의 다른 목적은 와이어의 유동을 방지할 수 있는 히팅장치를 구비한 웨지 툴을 제공함에 있다.
상기와 같은 본 발명의 목적을 달성하기 위하여 와이어본딩시 와이어를 누르기 위한 웨지 툴이 구비되어 있는 웨지장비에 있어서, 상기 웨지 툴의 외주면에 웨지툴을 가열하기 위한 열판을 설치하여서 구성되는 것을 특징으로 하는 히팅장치를 구비한 웨지 공구가 제공된다.
이하, 본 발명의 실시예들을 첨부도면에 의거하여 상세히 설명하면 다음과 같다.
제3도의 (a)는 본 발명의 일실시예를 나타낸 단면도이다. 참고부호 14는 웨지 장비(도시되지 않음)에 끼워지게 될 웨지 툴을 나타낸다. 상기 웨지 툴(14)의 상부 소정부위에 형성된 삽입구멍(15)에는 열선(16)을 구비한 금속봉(17)이 끼워진다. 그리고, 상기 금속봉(17)의 열선(16)에는 소정의 교류전원을 공급하기 위한 파워 공급수단(18)이 도면상에는 상세히 나타내지 않았지만 상기 웨지장비의 소정부위에 설치되어 연결된다.
그리고, 상기 웨지 툴(14)의 하부에는 제3도의 (b)에 도시된 바와 같이, 와이어(26)의 유동을 방지하기 위하여 돌출턱(21)의 내측에 홈(20)이 형성된다. 그리고, 상기 홈(20)에는 와이어(26)가 관통하여 지나가게 된다.
한편, 상기 웨지 툴(14)은 그 하부에 형성된 홈(20)에 와이어(26)를 끼운 상태하에서, 파워공급수단(18)에 전원을 공급하여 주게 되면, 상기 웨지 툴(14)의 소정부위에 끼워진 금속봉(17)의 열선(16)에 열이 공급되게 된다. 여기서, 열은 200 내지 250℃ 정도이다.
결국, 본 발명의 실시예에 따른 웨지 툴(14)은 와이어 본딩 공정시, 웨지 툴(14)의 하부 즉, A부분에 소정의 열을 제공하므로 와이어(26)의 본딩력(Bondability)이 개선되게 된다.
한편, 제4도는 본 발명의 다른 실시예를 나타낸 단면도이다.
본 발명의 다른 실시예는 전술한 실시예의 열선(16)을 구비한 금속봉(17) 대신에 웨지 툴(14)의 외주 소정부위에 권선된 열전달 수단으로 대체할 수 있도록 구성시킨 것이다. 그리고, 상기 열전달 수단은 도전성 와이어(23)를 사용하게 된다.
상기 도전성 와이어(23)도 전술한 실시예에서와 마찬가지로 파워공급 수단(18)에 연결되게 된다. 그러므로, 본 발명의 다른 실시예도 웨지 툴에 히팅장치가 구비되므로 양호한 와이어 본딩을 수행할 수 있게 된다.
제5도는 본 발명의 또 다른 실시예를 나타낸 단면도이다.
본 발명의 또 다른 실시예에서는, 전술한 실시예의 도전성 와이어(23)(제4도 참조)대신에 박막형태의 열판(29)을 사용하게 된다. 그리고, 상기 열판(29)도 전술한 실시예들과 마찬가지로 파워공급수단(18)에 연결하게 된다.
이와 같이, 본 발명의 또 다른 실시예도 웨지 툴에 역시 히팅장치를 설치하게 되므로 양호한 와이어 본딩을 수행할 수 있게 된다.
상기와 같이 구성된 히팅장치를 구비한 웨지 툴은 열전달이 어려운 반도체 패키지에 열을 발생시킬 수 있는 히팅장치나 히팅시스템을 구비함으로써 양호한 본딩력을 얻을 수 있다.

Claims (1)

  1. 와이어본딩시 와이어를 누르기 위한 웨지 툴이 구비되어 있는 웨지장비에 있어서, 상기 웨지 툴의 외주면에 웨지 툴을 가열하기 위한 열판을 설치하여서 구성되는 것을 특징으로 하는 히팅장치를 구비한 웨지 공구.
KR1019950028689A 1995-09-02 1995-09-02 히팅장치를 구비한 웨지 공구 KR0186084B1 (ko)

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KR1019950028689A KR0186084B1 (ko) 1995-09-02 1995-09-02 히팅장치를 구비한 웨지 공구
US08/589,678 US5958270A (en) 1995-09-02 1996-01-22 Wire bonding wedge tool with electric heater
JP8012760A JP2741496B2 (ja) 1995-09-02 1996-01-29 ヒーターを有したウェッジ工具
CN96109498A CN1083157C (zh) 1995-09-02 1996-08-30 具有加热装置的劈头

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CN1146633A (zh) 1997-04-02
US5958270A (en) 1999-09-28
JP2741496B2 (ja) 1998-04-15
CN1083157C (zh) 2002-04-17
JPH0974114A (ja) 1997-03-18

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