KR0157307B1 - 리드 프레임용 접착 테이프 - Google Patents

리드 프레임용 접착 테이프 Download PDF

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Publication number
KR0157307B1
KR0157307B1 KR1019900010386A KR900010386A KR0157307B1 KR 0157307 B1 KR0157307 B1 KR 0157307B1 KR 1019900010386 A KR1019900010386 A KR 1019900010386A KR 900010386 A KR900010386 A KR 900010386A KR 0157307 B1 KR0157307 B1 KR 0157307B1
Authority
KR
South Korea
Prior art keywords
adhesive tape
heat resistant
film
lead frame
adhesive
Prior art date
Application number
KR1019900010386A
Other languages
English (en)
Korean (ko)
Other versions
KR910003054A (ko
Inventor
유기노리 사쿠모토
시게유키 요코야마
아키히로 시부야
아쯔시 코시무라
미쯔하라 시미즈
히로후미 후지
Original Assignee
이노우에다카오
가부시키가이샤 도모에가와 세이시쇼
이노우에 사다오
신고우 덴키 코교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에다카오, 가부시키가이샤 도모에가와 세이시쇼, 이노우에 사다오, 신고우 덴키 코교 가부시키가이샤 filed Critical 이노우에다카오
Publication of KR910003054A publication Critical patent/KR910003054A/ko
Application granted granted Critical
Publication of KR0157307B1 publication Critical patent/KR0157307B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019900010386A 1989-07-10 1990-07-10 리드 프레임용 접착 테이프 KR0157307B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1175444A JPH0620087B2 (ja) 1989-07-10 1989-07-10 リードフレーム用接着テープ
JP89-175444 1989-07-10

Publications (2)

Publication Number Publication Date
KR910003054A KR910003054A (ko) 1991-02-26
KR0157307B1 true KR0157307B1 (ko) 1999-02-01

Family

ID=15996191

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900010386A KR0157307B1 (ko) 1989-07-10 1990-07-10 리드 프레임용 접착 테이프

Country Status (2)

Country Link
JP (1) JPH0620087B2 (ja)
KR (1) KR0157307B1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2567998B2 (ja) * 1991-03-20 1996-12-25 株式会社日立製作所 半導体装置
US5773113A (en) * 1996-11-21 1998-06-30 Brady Precision Tape Co. Adhesive compositions for electronic applications
JP2006093438A (ja) 2004-09-24 2006-04-06 Denso Corp プリント基板及びその製造方法
MXPA06010596A (es) * 2005-12-23 2007-06-22 3M Innovative Properties Co Pelicula adhesiva con resistencia a altas temperaturas y baja generacion de electrostatica, construida con un polimero de polieterimida.
CN102092168B (zh) * 2010-12-01 2013-04-17 秦皇岛福园新能源科技有限公司 全自动多层太阳能电池组件层压机

Also Published As

Publication number Publication date
KR910003054A (ko) 1991-02-26
JPH0341743A (ja) 1991-02-22
JPH0620087B2 (ja) 1994-03-16

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