KR0135244B1 - Probe card - Google Patents

Probe card

Info

Publication number
KR0135244B1
KR0135244B1 KR94016769A KR19940016769A KR0135244B1 KR 0135244 B1 KR0135244 B1 KR 0135244B1 KR 94016769 A KR94016769 A KR 94016769A KR 19940016769 A KR19940016769 A KR 19940016769A KR 0135244 B1 KR0135244 B1 KR 0135244B1
Authority
KR
South Korea
Prior art keywords
probe card
probe
card
Prior art date
Application number
KR94016769A
Other languages
English (en)
Other versions
KR960005745A (ko
Inventor
Byung-Ok Park
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Priority to KR94016769A priority Critical patent/KR0135244B1/ko
Priority to CN95109441A priority patent/CN1076871C/zh
Publication of KR960005745A publication Critical patent/KR960005745A/ko
Application granted granted Critical
Publication of KR0135244B1 publication Critical patent/KR0135244B1/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
KR94016769A 1994-07-12 1994-07-12 Probe card KR0135244B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR94016769A KR0135244B1 (en) 1994-07-12 1994-07-12 Probe card
CN95109441A CN1076871C (zh) 1994-07-12 1995-07-12 探测卡

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94016769A KR0135244B1 (en) 1994-07-12 1994-07-12 Probe card

Publications (2)

Publication Number Publication Date
KR960005745A KR960005745A (ko) 1996-02-23
KR0135244B1 true KR0135244B1 (en) 1998-04-25

Family

ID=19387831

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94016769A KR0135244B1 (en) 1994-07-12 1994-07-12 Probe card

Country Status (2)

Country Link
KR (1) KR0135244B1 (ko)
CN (1) CN1076871C (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7145353B2 (en) * 2004-04-01 2006-12-05 Wentworth Laboratories, Inc. Double side probing of semiconductor devices
CN100343968C (zh) * 2004-04-09 2007-10-17 矽统科技股份有限公司 测试装置的探测头
DE102004023987B4 (de) * 2004-05-14 2008-06-19 Feinmetall Gmbh Elektrische Prüfeinrichtung
KR100557201B1 (ko) * 2004-06-14 2006-03-10 주식회사 파이컴 프로브 본딩용 실리콘 웨이퍼 및 모듈 및 이를 이용한 프로브 본딩 방법
EP1870714A4 (en) * 2005-03-31 2010-05-19 Octec Inc MICROSTRUCTURE PROBE CARD AND MICROSTRUCTURE INSPECTION DEVICE, METHOD AND COMPUTER PROGRAM
US8330481B2 (en) * 2007-07-02 2012-12-11 Jae Ha Lee Probe assembly and manufacturing method thereof
CN102651506A (zh) * 2011-02-23 2012-08-29 光九实业股份有限公司 具有弯曲导线的导电胶体
TWI434044B (zh) * 2011-07-12 2014-04-11 Advanced Semiconductor Eng 探針卡及其製作方法
SG10201707975VA (en) * 2013-07-11 2017-10-30 Johnstech Int Corp Testing apparatus and method for microcircuit and wafer level ic testing
CN106526449B (zh) * 2016-10-26 2019-02-12 华为技术有限公司 一种芯片测试板及芯片测试的方法
CN110389243B (zh) * 2018-04-18 2022-05-06 台湾中华精测科技股份有限公司 探针卡装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180330A (ja) * 1984-09-26 1986-04-23 Fujitsu Ltd 音声認識装置
JPH04145638A (ja) * 1990-10-05 1992-05-19 Tokyo Kasoode Kenkyusho:Kk 半導体ウエハ検査装置

Also Published As

Publication number Publication date
CN1121644A (zh) 1996-05-01
KR960005745A (ko) 1996-02-23
CN1076871C (zh) 2001-12-26

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
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