GB9903309D0 - Probe card - Google Patents

Probe card

Info

Publication number
GB9903309D0
GB9903309D0 GBGB9903309.4A GB9903309A GB9903309D0 GB 9903309 D0 GB9903309 D0 GB 9903309D0 GB 9903309 A GB9903309 A GB 9903309A GB 9903309 D0 GB9903309 D0 GB 9903309D0
Authority
GB
United Kingdom
Prior art keywords
probe card
probe
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9903309.4A
Other versions
GB2331877A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of GB9903309D0 publication Critical patent/GB9903309D0/en
Publication of GB2331877A publication Critical patent/GB2331877A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
GB9903309A 1997-06-17 1998-06-17 Probe card Withdrawn GB2331877A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16009997 1997-06-17
PCT/JP1998/002669 WO1998058266A1 (en) 1997-06-17 1998-06-17 Probe card

Publications (2)

Publication Number Publication Date
GB9903309D0 true GB9903309D0 (en) 1999-04-07
GB2331877A GB2331877A (en) 1999-06-02

Family

ID=15707837

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9903309A Withdrawn GB2331877A (en) 1997-06-17 1998-06-17 Probe card

Country Status (6)

Country Link
KR (1) KR20000068145A (en)
CN (1) CN1228160A (en)
DE (1) DE19881035T1 (en)
GB (1) GB2331877A (en)
TW (1) TW369601B (en)
WO (1) WO1998058266A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002098736A (en) 2000-09-26 2002-04-05 Nec Corp Semiconductor device testing device
US7700379B2 (en) 2001-08-13 2010-04-20 Finisar Corporation Methods of conducting wafer level burn-in of electronic devices
CN1568432A (en) 2001-08-13 2005-01-19 霍尼韦尔国际公司 Providing current control over wafer borne semiconductor devices using trenches
US8039277B2 (en) 2001-08-13 2011-10-18 Finisar Corporation Providing current control over wafer borne semiconductor devices using overlayer patterns
JP4134289B2 (en) * 2002-05-29 2008-08-20 東京エレクトロン株式会社 Probe card transport device and adapter
JP2004205487A (en) 2002-11-01 2004-07-22 Tokyo Electron Ltd Probe card fixing mechanism
JP2004185208A (en) * 2002-12-02 2004-07-02 Sony Corp Ic card
US7202682B2 (en) * 2002-12-20 2007-04-10 Formfactor, Inc. Composite motion probing
US7057404B2 (en) * 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7084651B2 (en) * 2004-07-28 2006-08-01 International Business Machines Corporation Probe card assembly
CN100508154C (en) * 2004-11-18 2009-07-01 株式会社瑞萨科技 Semiconductor IC device manufacturing method
JP4769474B2 (en) * 2005-04-06 2011-09-07 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
JP5334355B2 (en) * 2005-05-27 2013-11-06 ヤマハファインテック株式会社 Electrical inspection apparatus and electrical inspection method for printed circuit board
JPWO2007029422A1 (en) 2005-09-07 2009-03-12 日本電気株式会社 Semiconductor device inspection device and power supply unit
JP4518041B2 (en) * 2006-05-19 2010-08-04 エルピーダメモリ株式会社 Probe card
JP5138615B2 (en) * 2008-02-15 2013-02-06 シャープ株式会社 Semiconductor function test electrical connection device
JP5406464B2 (en) * 2008-04-17 2014-02-05 日本電子材料株式会社 Probe card
KR101583000B1 (en) 2009-03-09 2016-01-19 삼성전자주식회사 Apparatus and method for testing semiconductor device
CN102914673B (en) * 2011-08-03 2015-09-30 旺矽科技股份有限公司 Probe testing device
JP2017194388A (en) * 2016-04-21 2017-10-26 日本電子材料株式会社 Probe card
CN108427021B (en) 2017-02-13 2020-08-21 华邦电子股份有限公司 Probe head, probe module and manufacturing method thereof
TWI619948B (en) * 2017-02-13 2018-04-01 華邦電子股份有限公司 Probe module, probe head and manufacturing method thereof
IT201700017037A1 (en) * 2017-02-15 2018-08-15 Technoprobe Spa Measurement board for high frequency applications
JP2019109103A (en) * 2017-12-18 2019-07-04 株式会社ヨコオ Inspection jig
PH12020050134A1 (en) * 2019-06-12 2021-09-01 Jf Microtechnology Sdn Bhd Wedged contact fingers for integrated circuit testing apparatus
TWI711824B (en) * 2019-10-02 2020-12-01 銳捷科技股份有限公司 Adjustable probe supporting device
TWI784439B (en) * 2021-03-12 2022-11-21 冠銓科技實業股份有限公司 Test needle seat structure for high frequency measurement

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61129501A (en) * 1984-11-28 1986-06-17 Olympus Optical Co Ltd Measuring instrument for movement extent of camera lens
JPH0524064Y2 (en) * 1986-03-20 1993-06-18
JPH01128381A (en) * 1987-11-12 1989-05-22 Fujitsu Ltd Examining method for lsi wafer
US5264787A (en) * 1991-08-30 1993-11-23 Hughes Aircraft Company Rigid-flex circuits with raised features as IC test probes
US5355079A (en) * 1993-01-07 1994-10-11 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuit devices
US5461326A (en) * 1993-02-25 1995-10-24 Hughes Aircraft Company Self leveling and self tensioning membrane test probe
JP2978720B2 (en) * 1994-09-09 1999-11-15 東京エレクトロン株式会社 Probe device

Also Published As

Publication number Publication date
DE19881035T1 (en) 1999-07-15
TW369601B (en) 1999-09-11
KR20000068145A (en) 2000-11-25
CN1228160A (en) 1999-09-08
WO1998058266A1 (en) 1998-12-23
GB2331877A (en) 1999-06-02

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Legal Events

Date Code Title Description
789A Request for publication of translation (sect. 89(a)/1977)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)