KR0129664B1 - 도포 설비 - Google Patents
도포 설비Info
- Publication number
- KR0129664B1 KR0129664B1 KR1019890002771A KR890002771A KR0129664B1 KR 0129664 B1 KR0129664 B1 KR 0129664B1 KR 1019890002771 A KR1019890002771 A KR 1019890002771A KR 890002771 A KR890002771 A KR 890002771A KR 0129664 B1 KR0129664 B1 KR 0129664B1
- Authority
- KR
- South Korea
- Prior art keywords
- temperature
- resist
- air
- coating
- clean air
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 72
- 239000011248 coating agent Substances 0.000 title claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000000428 dust Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims 2
- 239000011247 coating layer Substances 0.000 claims 1
- 238000007791 dehumidification Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 84
- 239000004065 semiconductor Substances 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000003749 cleanliness Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 101150038956 cup-4 gene Proteins 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5568888 | 1988-03-09 | ||
JP55688 | 1988-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890015373A KR890015373A (ko) | 1989-10-30 |
KR0129664B1 true KR0129664B1 (ko) | 1998-04-06 |
Family
ID=13005844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890002771A KR0129664B1 (ko) | 1988-03-09 | 1989-03-07 | 도포 설비 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3112446B2 (ja) |
KR (1) | KR0129664B1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100752535B1 (ko) * | 1999-08-27 | 2007-08-29 | 마이크론 테크놀로지 인코포레이티드 | 스피닝 마이크로전자 기판 위의 공기를 제어하기 위한방법 및 장치 |
US8591224B2 (en) | 2006-09-29 | 2013-11-26 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6432204B1 (en) | 2000-05-17 | 2002-08-13 | Tokyo Electron Limited | Temperature and humidity controlled processing system |
US7326437B2 (en) | 2003-12-29 | 2008-02-05 | Asml Holding N.V. | Method and system for coating polymer solution on a substrate in a solvent saturated chamber |
JP4522766B2 (ja) * | 2004-07-02 | 2010-08-11 | 株式会社シンク・ラボラトリー | 感光膜塗布装置及び製版工場 |
MX2009012143A (es) * | 2007-05-23 | 2010-03-01 | Tokuyama Corp | Dispositivo para recubrimiento de lentes. |
CN100451905C (zh) * | 2007-08-10 | 2009-01-14 | 杭州亿恒科技有限公司 | 可编程温湿度控制器 |
JP5306300B2 (ja) * | 2010-09-15 | 2013-10-02 | 株式会社東芝 | 成膜装置及び成膜方法 |
-
1989
- 1989-03-07 KR KR1019890002771A patent/KR0129664B1/ko not_active IP Right Cessation
-
1998
- 1998-08-11 JP JP10237955A patent/JP3112446B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100752535B1 (ko) * | 1999-08-27 | 2007-08-29 | 마이크론 테크놀로지 인코포레이티드 | 스피닝 마이크로전자 기판 위의 공기를 제어하기 위한방법 및 장치 |
US8591224B2 (en) | 2006-09-29 | 2013-11-26 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
Also Published As
Publication number | Publication date |
---|---|
JPH11135427A (ja) | 1999-05-21 |
KR890015373A (ko) | 1989-10-30 |
JP3112446B2 (ja) | 2000-11-27 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
O035 | Opposition [patent]: request for opposition | ||
O132 | Decision on opposition [patent] | ||
O074 | Maintenance of registration after opposition [patent]: final registration of opposition | ||
FPAY | Annual fee payment |
Payment date: 20101111 Year of fee payment: 14 |
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LAPS | Lapse due to unpaid annual fee |