KR0129664B1 - 도포 설비 - Google Patents

도포 설비

Info

Publication number
KR0129664B1
KR0129664B1 KR1019890002771A KR890002771A KR0129664B1 KR 0129664 B1 KR0129664 B1 KR 0129664B1 KR 1019890002771 A KR1019890002771 A KR 1019890002771A KR 890002771 A KR890002771 A KR 890002771A KR 0129664 B1 KR0129664 B1 KR 0129664B1
Authority
KR
South Korea
Prior art keywords
temperature
resist
air
coating
clean air
Prior art date
Application number
KR1019890002771A
Other languages
English (en)
Korean (ko)
Other versions
KR890015373A (ko
Inventor
마사시 모리야마
Original Assignee
고다까 토시오
도오교오 에레구토론 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고다까 토시오, 도오교오 에레구토론 가부시끼가이샤 filed Critical 고다까 토시오
Publication of KR890015373A publication Critical patent/KR890015373A/ko
Application granted granted Critical
Publication of KR0129664B1 publication Critical patent/KR0129664B1/ko

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Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1019890002771A 1988-03-09 1989-03-07 도포 설비 KR0129664B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5568888 1988-03-09
JP55688 1988-03-09

Publications (2)

Publication Number Publication Date
KR890015373A KR890015373A (ko) 1989-10-30
KR0129664B1 true KR0129664B1 (ko) 1998-04-06

Family

ID=13005844

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890002771A KR0129664B1 (ko) 1988-03-09 1989-03-07 도포 설비

Country Status (2)

Country Link
JP (1) JP3112446B2 (ja)
KR (1) KR0129664B1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100752535B1 (ko) * 1999-08-27 2007-08-29 마이크론 테크놀로지 인코포레이티드 스피닝 마이크로전자 기판 위의 공기를 제어하기 위한방법 및 장치
US8591224B2 (en) 2006-09-29 2013-11-26 Tokyo Electron Limited Substrate processing apparatus and substrate processing method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432204B1 (en) 2000-05-17 2002-08-13 Tokyo Electron Limited Temperature and humidity controlled processing system
US7326437B2 (en) 2003-12-29 2008-02-05 Asml Holding N.V. Method and system for coating polymer solution on a substrate in a solvent saturated chamber
JP4522766B2 (ja) * 2004-07-02 2010-08-11 株式会社シンク・ラボラトリー 感光膜塗布装置及び製版工場
MX2009012143A (es) * 2007-05-23 2010-03-01 Tokuyama Corp Dispositivo para recubrimiento de lentes.
CN100451905C (zh) * 2007-08-10 2009-01-14 杭州亿恒科技有限公司 可编程温湿度控制器
JP5306300B2 (ja) * 2010-09-15 2013-10-02 株式会社東芝 成膜装置及び成膜方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100752535B1 (ko) * 1999-08-27 2007-08-29 마이크론 테크놀로지 인코포레이티드 스피닝 마이크로전자 기판 위의 공기를 제어하기 위한방법 및 장치
US8591224B2 (en) 2006-09-29 2013-11-26 Tokyo Electron Limited Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
JPH11135427A (ja) 1999-05-21
KR890015373A (ko) 1989-10-30
JP3112446B2 (ja) 2000-11-27

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