JPWO2025183021A5 - - Google Patents

Info

Publication number
JPWO2025183021A5
JPWO2025183021A5 JP2025536419A JP2025536419A JPWO2025183021A5 JP WO2025183021 A5 JPWO2025183021 A5 JP WO2025183021A5 JP 2025536419 A JP2025536419 A JP 2025536419A JP 2025536419 A JP2025536419 A JP 2025536419A JP WO2025183021 A5 JPWO2025183021 A5 JP WO2025183021A5
Authority
JP
Japan
Prior art keywords
adhesive tape
double bond
tape according
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025536419A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025183021A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2025/006716 external-priority patent/WO2025183021A1/ja
Publication of JPWO2025183021A1 publication Critical patent/JPWO2025183021A1/ja
Publication of JPWO2025183021A5 publication Critical patent/JPWO2025183021A5/ja
Pending legal-status Critical Current

Links

JP2025536419A 2024-03-01 2025-02-26 Pending JPWO2025183021A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024031471 2024-03-01
PCT/JP2025/006716 WO2025183021A1 (ja) 2024-03-01 2025-02-26 粘着テープ

Publications (2)

Publication Number Publication Date
JPWO2025183021A1 JPWO2025183021A1 (https=) 2025-09-04
JPWO2025183021A5 true JPWO2025183021A5 (https=) 2026-02-04

Family

ID=96920905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025536419A Pending JPWO2025183021A1 (https=) 2024-03-01 2025-02-26

Country Status (3)

Country Link
JP (1) JPWO2025183021A1 (https=)
TW (1) TW202547954A (https=)
WO (1) WO2025183021A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5528861B2 (ja) * 2009-04-15 2014-06-25 株式会社イーテック 紫外線硬化型粘着剤組成物
JP6210827B2 (ja) * 2013-10-04 2017-10-11 リンテック株式会社 半導体加工用シート
EP3546540A4 (en) * 2016-11-25 2020-10-14 Mitsui Chemicals Tohcello, Inc. ADHESIVE LAMINATE FILM AND ELECTRONIC DEVICE PRODUCTION PROCESS
JP7025138B2 (ja) * 2017-06-15 2022-02-24 三井化学東セロ株式会社 粘着性積層フィルムおよび電子装置の製造方法
KR102757722B1 (ko) * 2020-05-22 2025-01-21 미쓰이 가가쿠 토세로 가부시키가이샤 점착성 적층 필름 및 전자 장치의 제조 방법
KR20230155529A (ko) * 2021-04-20 2023-11-10 미쓰이 가가쿠 토세로 가부시키가이샤 점착성 수지 필름 및 전자 장치의 제조 방법
TW202330849A (zh) * 2021-10-21 2023-08-01 日商積水化學工業股份有限公司 黏著帶

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