JPWO2025079715A5 - - Google Patents

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Publication number
JPWO2025079715A5
JPWO2025079715A5 JP2025551704A JP2025551704A JPWO2025079715A5 JP WO2025079715 A5 JPWO2025079715 A5 JP WO2025079715A5 JP 2025551704 A JP2025551704 A JP 2025551704A JP 2025551704 A JP2025551704 A JP 2025551704A JP WO2025079715 A5 JPWO2025079715 A5 JP WO2025079715A5
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JP
Japan
Prior art keywords
region
thinning
trench
contact
conductivity type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025551704A
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English (en)
Japanese (ja)
Other versions
JPWO2025079715A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/036553 external-priority patent/WO2025079715A1/ja
Publication of JPWO2025079715A1 publication Critical patent/JPWO2025079715A1/ja
Publication of JPWO2025079715A5 publication Critical patent/JPWO2025079715A5/ja
Pending legal-status Critical Current

Links

JP2025551704A 2023-10-13 2024-10-11 Pending JPWO2025079715A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023177452 2023-10-13
PCT/JP2024/036553 WO2025079715A1 (ja) 2023-10-13 2024-10-11 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025079715A1 JPWO2025079715A1 (https=) 2025-04-17
JPWO2025079715A5 true JPWO2025079715A5 (https=) 2025-12-17

Family

ID=95395677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025551704A Pending JPWO2025079715A1 (https=) 2023-10-13 2024-10-11

Country Status (4)

Country Link
US (1) US20260020293A1 (https=)
JP (1) JPWO2025079715A1 (https=)
CN (1) CN120937521A (https=)
WO (1) WO2025079715A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101396611B1 (ko) * 2010-04-28 2014-05-16 닛산 지도우샤 가부시키가이샤 반도체 장치
JP2014075582A (ja) * 2012-09-12 2014-04-24 Fuji Electric Co Ltd 半導体装置および半導体装置の製造方法
JP6863479B2 (ja) * 2017-12-14 2021-04-21 富士電機株式会社 半導体装置およびその製造方法
JP7101593B2 (ja) * 2018-10-30 2022-07-15 三菱電機株式会社 半導体装置
JP7247930B2 (ja) * 2020-03-10 2023-03-29 株式会社デンソー 半導体装置
JP7848526B2 (ja) * 2022-03-15 2026-04-21 富士電機株式会社 半導体装置

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