JPWO2025062637A1 - - Google Patents
Info
- Publication number
- JPWO2025062637A1 JPWO2025062637A1 JP2024517145A JP2024517145A JPWO2025062637A1 JP WO2025062637 A1 JPWO2025062637 A1 JP WO2025062637A1 JP 2024517145 A JP2024517145 A JP 2024517145A JP 2024517145 A JP2024517145 A JP 2024517145A JP WO2025062637 A1 JPWO2025062637 A1 JP WO2025062637A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/034522 WO2025062637A1 (ja) | 2023-09-22 | 2023-09-22 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025062637A1 true JPWO2025062637A1 (https=) | 2025-03-27 |
| JP7678934B1 JP7678934B1 (ja) | 2025-05-16 |
| JPWO2025062637A5 JPWO2025062637A5 (https=) | 2025-08-27 |
Family
ID=95072624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024517145A Active JP7678934B1 (ja) | 2023-09-22 | 2023-09-22 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7678934B1 (https=) |
| CN (1) | CN121890330A (https=) |
| WO (1) | WO2025062637A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04167565A (ja) * | 1990-10-31 | 1992-06-15 | Fujitsu Ltd | フリップチップ型受光素子 |
| JP2000114413A (ja) * | 1998-09-29 | 2000-04-21 | Sony Corp | 半導体装置、その製造方法および部品の実装方法 |
| JP3639515B2 (ja) * | 2000-09-04 | 2005-04-20 | 三洋電機株式会社 | Ｍｏｓｆｅｔの実装構造の製造方法 |
| US7786558B2 (en) * | 2005-10-20 | 2010-08-31 | Infineon Technologies Ag | Semiconductor component and methods to produce a semiconductor component |
| ITMI20111213A1 (it) * | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Dispositivo elettronico a semi-ponte con dissipatore di calore ausiliario comune |
| US9673163B2 (en) * | 2011-10-18 | 2017-06-06 | Rohm Co., Ltd. | Semiconductor device with flip chip structure and fabrication method of the semiconductor device |
| US9653386B2 (en) * | 2014-10-16 | 2017-05-16 | Infineon Technologies Americas Corp. | Compact multi-die power semiconductor package |
| EP3648159B1 (en) * | 2018-10-31 | 2021-12-15 | Infineon Technologies Austria AG | Semiconductor package and method of fabricating a semiconductor package |
| WO2021112590A2 (ko) * | 2019-12-05 | 2021-06-10 | 주식회사 아모센스 | 전력반도체 모듈 |
| IT202000032267A1 (it) * | 2020-12-23 | 2022-06-23 | St Microelectronics Srl | Dispositivo elettronico incapsulato ad elevata dissipazione termica e relativo procedimento di fabbricazione |
-
2023
- 2023-09-22 CN CN202380102351.0A patent/CN121890330A/zh active Pending
- 2023-09-22 WO PCT/JP2023/034522 patent/WO2025062637A1/ja active Pending
- 2023-09-22 JP JP2024517145A patent/JP7678934B1/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN121890330A (zh) | 2026-04-17 |
| WO2025062637A1 (ja) | 2025-03-27 |
| JP7678934B1 (ja) | 2025-05-16 |
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