JPWO2025046720A1 - - Google Patents
Info
- Publication number
- JPWO2025046720A1 JPWO2025046720A1 JP2024513175A JP2024513175A JPWO2025046720A1 JP WO2025046720 A1 JPWO2025046720 A1 JP WO2025046720A1 JP 2024513175 A JP2024513175 A JP 2024513175A JP 2024513175 A JP2024513175 A JP 2024513175A JP WO2025046720 A1 JPWO2025046720 A1 JP WO2025046720A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3323—Problems associated with coating uniformity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
- H01J2237/3343—Problems associated with etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/031085 WO2025046720A1 (ja) | 2023-08-29 | 2023-08-29 | 半導体製造装置用部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025046720A1 true JPWO2025046720A1 (https=) | 2025-03-06 |
| JPWO2025046720A5 JPWO2025046720A5 (https=) | 2025-08-06 |
| JP7751079B2 JP7751079B2 (ja) | 2025-10-07 |
Family
ID=94773396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024513175A Active JP7751079B2 (ja) | 2023-08-29 | 2023-08-29 | 半導体製造装置用部材 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250079134A1 (https=) |
| JP (1) | JP7751079B2 (https=) |
| CN (1) | CN121753542A (https=) |
| TW (1) | TW202512376A (https=) |
| WO (1) | WO2025046720A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2026053937A (ja) * | 2024-09-13 | 2026-03-26 | 日本特殊陶業株式会社 | 保持装置、および、保持装置の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016027601A (ja) * | 2014-06-24 | 2016-02-18 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| JP2016127090A (ja) * | 2014-12-26 | 2016-07-11 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| JP2020113603A (ja) * | 2019-01-09 | 2020-07-27 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理装置の載置台 |
| JP2023005203A (ja) * | 2021-06-28 | 2023-01-18 | 東京エレクトロン株式会社 | 基板支持体、基板支持体アセンブリ及びプラズマ処理装置 |
| JP2023039202A (ja) * | 2021-09-08 | 2023-03-20 | 東京エレクトロン株式会社 | 基板支持体アセンブリ及びプラズマ処理装置 |
-
2023
- 2023-08-29 WO PCT/JP2023/031085 patent/WO2025046720A1/ja active Pending
- 2023-08-29 CN CN202380013640.3A patent/CN121753542A/zh active Pending
- 2023-08-29 JP JP2024513175A patent/JP7751079B2/ja active Active
-
2024
- 2024-02-27 US US18/588,280 patent/US20250079134A1/en active Pending
- 2024-07-10 TW TW113125815A patent/TW202512376A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016027601A (ja) * | 2014-06-24 | 2016-02-18 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| JP2016127090A (ja) * | 2014-12-26 | 2016-07-11 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| JP2020113603A (ja) * | 2019-01-09 | 2020-07-27 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理装置の載置台 |
| JP2023005203A (ja) * | 2021-06-28 | 2023-01-18 | 東京エレクトロン株式会社 | 基板支持体、基板支持体アセンブリ及びプラズマ処理装置 |
| JP2023039202A (ja) * | 2021-09-08 | 2023-03-20 | 東京エレクトロン株式会社 | 基板支持体アセンブリ及びプラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN121753542A (zh) | 2026-03-27 |
| TW202512376A (zh) | 2025-03-16 |
| US20250079134A1 (en) | 2025-03-06 |
| JP7751079B2 (ja) | 2025-10-07 |
| WO2025046720A1 (ja) | 2025-03-06 |
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