JPWO2025041629A5 - - Google Patents

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Publication number
JPWO2025041629A5
JPWO2025041629A5 JP2025510373A JP2025510373A JPWO2025041629A5 JP WO2025041629 A5 JPWO2025041629 A5 JP WO2025041629A5 JP 2025510373 A JP2025510373 A JP 2025510373A JP 2025510373 A JP2025510373 A JP 2025510373A JP WO2025041629 A5 JPWO2025041629 A5 JP WO2025041629A5
Authority
JP
Japan
Prior art keywords
cassette
substrate processing
processing apparatus
transport
transport block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510373A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025041629A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/028409 external-priority patent/WO2025041629A1/ja
Publication of JPWO2025041629A1 publication Critical patent/JPWO2025041629A1/ja
Publication of JPWO2025041629A5 publication Critical patent/JPWO2025041629A5/ja
Pending legal-status Critical Current

Links

JP2025510373A 2023-08-21 2024-08-08 Pending JPWO2025041629A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023134101 2023-08-21
PCT/JP2024/028409 WO2025041629A1 (ja) 2023-08-21 2024-08-08 基板処理装置及び搬送方法

Publications (2)

Publication Number Publication Date
JPWO2025041629A1 JPWO2025041629A1 (https=) 2025-02-27
JPWO2025041629A5 true JPWO2025041629A5 (https=) 2025-07-30

Family

ID=94732074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510373A Pending JPWO2025041629A1 (https=) 2023-08-21 2024-08-08

Country Status (5)

Country Link
US (1) US20260076144A1 (https=)
JP (1) JPWO2025041629A1 (https=)
CN (1) CN120239900A (https=)
TW (1) TW202516663A (https=)
WO (1) WO2025041629A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20260005053A1 (en) * 2024-06-28 2026-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4887332B2 (ja) * 2007-09-20 2012-02-29 東京エレクトロン株式会社 基板の処理装置
JP6024433B2 (ja) 2012-12-10 2016-11-16 東京エレクトロン株式会社 基板処理装置、基板処理システム及び搬送容器の異常検出方法
JP6954597B2 (ja) * 2017-05-25 2021-10-27 株式会社プロスパイン 磁気式浮上搬送装置
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
JP7213056B2 (ja) * 2018-10-18 2023-01-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7412137B2 (ja) * 2019-11-06 2024-01-12 東京エレクトロン株式会社 基板処理装置及び基板収納容器保管方法

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