JPWO2024257574A5 - - Google Patents

Info

Publication number
JPWO2024257574A5
JPWO2024257574A5 JP2025527608A JP2025527608A JPWO2024257574A5 JP WO2024257574 A5 JPWO2024257574 A5 JP WO2024257574A5 JP 2025527608 A JP2025527608 A JP 2025527608A JP 2025527608 A JP2025527608 A JP 2025527608A JP WO2024257574 A5 JPWO2024257574 A5 JP WO2024257574A5
Authority
JP
Japan
Prior art keywords
element substrate
main surface
circuit board
chip component
coil conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025527608A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024257574A1 (enExample
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/018969 external-priority patent/WO2024257574A1/ja
Publication of JPWO2024257574A1 publication Critical patent/JPWO2024257574A1/ja
Publication of JPWO2024257574A5 publication Critical patent/JPWO2024257574A5/ja
Pending legal-status Critical Current

Links

JP2025527608A 2023-06-13 2024-05-23 Pending JPWO2024257574A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023096990 2023-06-13
PCT/JP2024/018969 WO2024257574A1 (ja) 2023-06-13 2024-05-23 電子回路装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024257574A1 JPWO2024257574A1 (enExample) 2024-12-19
JPWO2024257574A5 true JPWO2024257574A5 (enExample) 2026-03-12

Family

ID=93851789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025527608A Pending JPWO2024257574A1 (enExample) 2023-06-13 2024-05-23

Country Status (4)

Country Link
US (1) US20260096028A1 (enExample)
JP (1) JPWO2024257574A1 (enExample)
CN (1) CN121312327A (enExample)
WO (1) WO2024257574A1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2571389B2 (ja) * 1987-09-03 1997-01-16 ティーディーケイ株式会社 積層型混成集積回路部品
JPH0555043A (ja) * 1991-08-22 1993-03-05 Fujitsu Ltd 小型コイルとその製造方法，磁気ヘツドの製造方法及び磁気記憶装置
US5844299A (en) * 1997-01-31 1998-12-01 National Semiconductor Corporation Integrated inductor
JP2002343904A (ja) * 2001-05-21 2002-11-29 Matsushita Electric Ind Co Ltd 半導体装置
DE10160829A1 (de) * 2001-12-11 2003-06-26 Infineon Technologies Ag Diodenschaltung und Verfahren zum Herstellen einer Diodenschaltung

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