JPWO2024257574A1 - - Google Patents

Info

Publication number
JPWO2024257574A1
JPWO2024257574A1 JP2025527608A JP2025527608A JPWO2024257574A1 JP WO2024257574 A1 JPWO2024257574 A1 JP WO2024257574A1 JP 2025527608 A JP2025527608 A JP 2025527608A JP 2025527608 A JP2025527608 A JP 2025527608A JP WO2024257574 A1 JPWO2024257574 A1 JP WO2024257574A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025527608A
Other languages
Japanese (ja)
Other versions
JPWO2024257574A5 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024257574A1 publication Critical patent/JPWO2024257574A1/ja
Publication of JPWO2024257574A5 publication Critical patent/JPWO2024257574A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1003Non-printed inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
JP2025527608A 2023-06-13 2024-05-23 Pending JPWO2024257574A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023096990 2023-06-13
PCT/JP2024/018969 WO2024257574A1 (ja) 2023-06-13 2024-05-23 電子回路装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024257574A1 true JPWO2024257574A1 (enExample) 2024-12-19
JPWO2024257574A5 JPWO2024257574A5 (enExample) 2026-03-12

Family

ID=93851789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025527608A Pending JPWO2024257574A1 (enExample) 2023-06-13 2024-05-23

Country Status (4)

Country Link
US (1) US20260096028A1 (enExample)
JP (1) JPWO2024257574A1 (enExample)
CN (1) CN121312327A (enExample)
WO (1) WO2024257574A1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2571389B2 (ja) * 1987-09-03 1997-01-16 ティーディーケイ株式会社 積層型混成集積回路部品
JPH0555043A (ja) * 1991-08-22 1993-03-05 Fujitsu Ltd 小型コイルとその製造方法,磁気ヘツドの製造方法及び磁気記憶装置
US5844299A (en) * 1997-01-31 1998-12-01 National Semiconductor Corporation Integrated inductor
JP2002343904A (ja) * 2001-05-21 2002-11-29 Matsushita Electric Ind Co Ltd 半導体装置
DE10160829A1 (de) * 2001-12-11 2003-06-26 Infineon Technologies Ag Diodenschaltung und Verfahren zum Herstellen einer Diodenschaltung

Also Published As

Publication number Publication date
WO2024257574A1 (ja) 2024-12-19
US20260096028A1 (en) 2026-04-02
CN121312327A (zh) 2026-01-09

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Legal Events

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Effective date: 20251212

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