JPWO2024214219A1 - - Google Patents
Info
- Publication number
- JPWO2024214219A1 JPWO2024214219A1 JP2025513575A JP2025513575A JPWO2024214219A1 JP WO2024214219 A1 JPWO2024214219 A1 JP WO2024214219A1 JP 2025513575 A JP2025513575 A JP 2025513575A JP 2025513575 A JP2025513575 A JP 2025513575A JP WO2024214219 A1 JPWO2024214219 A1 JP WO2024214219A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/06—Planarisation of inorganic insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P10/00—Bonding of wafers, substrates or parts of devices
- H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
- H10P10/128—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
- H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/08—Planarisation of organic insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01351—Changing the shapes of die-attach connectors
- H10W72/01353—Changing the shapes of die-attach connectors by etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01351—Changing the shapes of die-attach connectors
- H10W72/01359—Changing the shapes of die-attach connectors by planarisation, e.g. chemical-mechanical polishing [CMP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/014899 WO2024214219A1 (ja) | 2023-04-12 | 2023-04-12 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024214219A1 true JPWO2024214219A1 (https=) | 2024-10-17 |
| JPWO2024214219A5 JPWO2024214219A5 (https=) | 2026-01-19 |
Family
ID=93058878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025513575A Pending JPWO2024214219A1 (https=) | 2023-04-12 | 2023-04-12 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260082837A1 (https=) |
| JP (1) | JPWO2024214219A1 (https=) |
| KR (1) | KR20250173514A (https=) |
| CN (1) | CN119137712A (https=) |
| TW (1) | TW202510081A (https=) |
| WO (1) | WO2024214219A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3472196B2 (ja) * | 1999-06-01 | 2003-12-02 | キヤノン株式会社 | エッチング方法及びそれを用いた半導体装置の製造方法 |
| JP4115761B2 (ja) * | 2002-07-05 | 2008-07-09 | アルプス電気株式会社 | アクティブマトリクス基板及びその製造方法並びにそれを用いた表示装置 |
| JP4606824B2 (ja) * | 2004-09-14 | 2011-01-05 | 共同印刷株式会社 | 有機ｅｌディスプレイの製造方法 |
| JP4450715B2 (ja) * | 2004-10-08 | 2010-04-14 | 三菱電機株式会社 | アクティブマトリクス型表示装置およびアクティブマトリクス型表示装置の製造方法 |
| JP2009015199A (ja) * | 2007-07-09 | 2009-01-22 | Nec Lcd Technologies Ltd | 液晶表示装置およびその製造方法 |
| JP2010230978A (ja) * | 2009-03-27 | 2010-10-14 | Fujitsu Ltd | 光半導体装置及びその製造方法 |
| US9953941B2 (en) | 2015-08-25 | 2018-04-24 | Invensas Bonding Technologies, Inc. | Conductive barrier direct hybrid bonding |
| JP7501133B2 (ja) | 2020-06-12 | 2024-06-18 | 株式会社レゾナック | 半導体装置の製造方法 |
| JP7543712B2 (ja) * | 2020-06-12 | 2024-09-03 | 株式会社レゾナック | 半導体装置の製造方法 |
| WO2022201531A1 (ja) * | 2021-03-26 | 2022-09-29 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法、洗浄装置、洗浄方法、及び、半導体装置 |
| WO2022201497A1 (ja) * | 2021-03-26 | 2022-09-29 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法、半導体装置、集積回路要素、及び、集積回路要素の製造方法 |
-
2023
- 2023-04-12 JP JP2025513575A patent/JPWO2024214219A1/ja active Pending
- 2023-04-12 CN CN202380035614.0A patent/CN119137712A/zh active Pending
- 2023-04-12 KR KR1020257035541A patent/KR20250173514A/ko active Pending
- 2023-04-12 WO PCT/JP2023/014899 patent/WO2024214219A1/ja not_active Ceased
- 2023-04-12 US US18/857,188 patent/US20260082837A1/en active Pending
-
2024
- 2024-04-10 TW TW113113324A patent/TW202510081A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024214219A1 (ja) | 2024-10-17 |
| KR20250173514A (ko) | 2025-12-10 |
| CN119137712A (zh) | 2024-12-13 |
| TW202510081A (zh) | 2025-03-01 |
| US20260082837A1 (en) | 2026-03-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250930 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260203 |