JPWO2024195503A1 - - Google Patents
Info
- Publication number
- JPWO2024195503A1 JPWO2024195503A1 JP2025508286A JP2025508286A JPWO2024195503A1 JP WO2024195503 A1 JPWO2024195503 A1 JP WO2024195503A1 JP 2025508286 A JP2025508286 A JP 2025508286A JP 2025508286 A JP2025508286 A JP 2025508286A JP WO2024195503 A1 JPWO2024195503 A1 JP WO2024195503A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/019—Manufacture or treatment using temporary auxiliary substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/14—Producing shaped prefabricated articles from the material by simple casting, the material being neither forcibly fed nor positively compacted
- B28B1/16—Producing shaped prefabricated articles from the material by simple casting, the material being neither forcibly fed nor positively compacted for producing layered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/08—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
- B28B11/0845—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads for smoothing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/08—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
- B28B11/0863—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads for profiling, e.g. making grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/08—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
- B28B11/10—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads by using presses
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
- C04B35/115—Translucent or transparent products
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/014—Manufacture or treatment using batch processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
- H10P72/7442—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023042969 | 2023-03-17 | ||
| PCT/JP2024/008119 WO2024195503A1 (ja) | 2023-03-17 | 2024-03-04 | 仮固定基板および仮固定基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024195503A1 true JPWO2024195503A1 (https=) | 2024-09-26 |
| JPWO2024195503A5 JPWO2024195503A5 (https=) | 2025-11-19 |
Family
ID=92841875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025508286A Pending JPWO2024195503A1 (https=) | 2023-03-17 | 2024-03-04 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260011597A1 (https=) |
| JP (1) | JPWO2024195503A1 (https=) |
| KR (1) | KR20250145080A (https=) |
| CN (1) | CN120752734A (https=) |
| TW (1) | TW202443721A (https=) |
| WO (1) | WO2024195503A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026074915A1 (ja) * | 2024-10-03 | 2026-04-09 | 日本碍子株式会社 | 仮固定基板および仮固定基板の製造方法 |
| WO2026074917A1 (ja) * | 2024-10-03 | 2026-04-09 | 日本碍子株式会社 | 仮固定基板および仮固定基板の製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11176714A (ja) * | 1997-12-08 | 1999-07-02 | Toshiba Corp | チャンバ内堆積膜測定装置とメンテナンス管理システム |
| JP3996557B2 (ja) * | 2003-07-09 | 2007-10-24 | 直江津電子工業株式会社 | 半導体接合ウエーハの製造方法 |
| JP5304112B2 (ja) | 2008-09-01 | 2013-10-02 | 日本電気硝子株式会社 | 薄膜付きガラス基板の製造方法 |
| JP2011023438A (ja) | 2009-07-14 | 2011-02-03 | Nippon Electric Glass Co Ltd | 基板接合体の製造方法 |
| JP2013105909A (ja) * | 2011-11-14 | 2013-05-30 | Toshiba Corp | 半導体装置の製造方法 |
| JP6004100B2 (ja) * | 2013-05-24 | 2016-10-05 | 富士電機株式会社 | 半導体装置の製造方法 |
| CN107074637A (zh) * | 2014-12-04 | 2017-08-18 | 日本电气硝子株式会社 | 玻璃板 |
| JP6313251B2 (ja) * | 2015-03-12 | 2018-04-18 | 東芝メモリ株式会社 | 半導体装置の製造方法 |
| TW201837009A (zh) | 2017-03-30 | 2018-10-16 | 日商日本碍子股份有限公司 | 暫時固定基板及電子元件的模塑方法 |
| TWI770110B (zh) | 2017-03-30 | 2022-07-11 | 日商日本碍子股份有限公司 | 暫時固定基板及電子元件的暫時固定方法 |
| CN113544819B (zh) * | 2019-03-22 | 2024-01-05 | 日本碍子株式会社 | 预固定基板、复合基板以及电子元件的剥离方法 |
| JP7303081B2 (ja) * | 2019-09-24 | 2023-07-04 | 日本碍子株式会社 | 仮固定基板、複合基板および電子部品の剥離方法 |
| JP7561157B2 (ja) * | 2022-03-31 | 2024-10-03 | 日本碍子株式会社 | 仮固定基板、仮固定基板の製造方法、および電子部品の仮固定方法 |
-
2024
- 2024-03-04 CN CN202480016737.4A patent/CN120752734A/zh active Pending
- 2024-03-04 KR KR1020257030055A patent/KR20250145080A/ko active Pending
- 2024-03-04 WO PCT/JP2024/008119 patent/WO2024195503A1/ja not_active Ceased
- 2024-03-04 JP JP2025508286A patent/JPWO2024195503A1/ja active Pending
- 2024-03-06 TW TW113108116A patent/TW202443721A/zh unknown
-
2025
- 2025-09-12 US US19/326,939 patent/US20260011597A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202443721A (zh) | 2024-11-01 |
| WO2024195503A1 (ja) | 2024-09-26 |
| KR20250145080A (ko) | 2025-10-13 |
| US20260011597A1 (en) | 2026-01-08 |
| CN120752734A (zh) | 2025-10-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250904 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250904 |