JPWO2024176976A1 - - Google Patents
Info
- Publication number
- JPWO2024176976A1 JPWO2024176976A1 JP2025502338A JP2025502338A JPWO2024176976A1 JP WO2024176976 A1 JPWO2024176976 A1 JP WO2024176976A1 JP 2025502338 A JP2025502338 A JP 2025502338A JP 2025502338 A JP2025502338 A JP 2025502338A JP WO2024176976 A1 JPWO2024176976 A1 JP WO2024176976A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/166—Sealing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023024921 | 2023-02-21 | ||
| JP2023024921 | 2023-02-21 | ||
| PCT/JP2024/005562 WO2024176976A1 (ja) | 2023-02-21 | 2024-02-16 | 壁部材およびプラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024176976A1 true JPWO2024176976A1 (https=) | 2024-08-29 |
| JPWO2024176976A5 JPWO2024176976A5 (https=) | 2025-08-25 |
| JP7770611B2 JP7770611B2 (ja) | 2025-11-14 |
Family
ID=92501208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025502338A Active JP7770611B2 (ja) | 2023-02-21 | 2024-02-16 | 壁部材およびプラズマ処理装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250364232A1 (https=) |
| JP (1) | JP7770611B2 (https=) |
| KR (1) | KR20250153776A (https=) |
| CN (1) | CN120693683A (https=) |
| TW (1) | TW202507794A (https=) |
| WO (1) | WO2024176976A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093411A (ja) * | 2004-09-24 | 2006-04-06 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2010258404A (ja) * | 2009-03-31 | 2010-11-11 | Tokyo Electron Ltd | 半導体製造装置及び温調方法 |
| JP2019197849A (ja) * | 2018-05-11 | 2019-11-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2021002642A (ja) * | 2019-06-18 | 2021-01-07 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP2022070597A (ja) * | 2020-10-27 | 2022-05-13 | 東京エレクトロン株式会社 | プラズマ処理装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5396256B2 (ja) | 2009-12-10 | 2014-01-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2024
- 2024-02-15 TW TW113105292A patent/TW202507794A/zh unknown
- 2024-02-16 KR KR1020257026941A patent/KR20250153776A/ko active Pending
- 2024-02-16 JP JP2025502338A patent/JP7770611B2/ja active Active
- 2024-02-16 CN CN202480012463.1A patent/CN120693683A/zh active Pending
- 2024-02-16 WO PCT/JP2024/005562 patent/WO2024176976A1/ja not_active Ceased
-
2025
- 2025-08-13 US US19/298,235 patent/US20250364232A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093411A (ja) * | 2004-09-24 | 2006-04-06 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2010258404A (ja) * | 2009-03-31 | 2010-11-11 | Tokyo Electron Ltd | 半導体製造装置及び温調方法 |
| JP2019197849A (ja) * | 2018-05-11 | 2019-11-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2021002642A (ja) * | 2019-06-18 | 2021-01-07 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP2022070597A (ja) * | 2020-10-27 | 2022-05-13 | 東京エレクトロン株式会社 | プラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024176976A1 (ja) | 2024-08-29 |
| CN120693683A (zh) | 2025-09-23 |
| TW202507794A (zh) | 2025-02-16 |
| US20250364232A1 (en) | 2025-11-27 |
| KR20250153776A (ko) | 2025-10-27 |
| JP7770611B2 (ja) | 2025-11-14 |
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