KR20250153776A - 벽부재 및 플라즈마 처리 장치 - Google Patents
벽부재 및 플라즈마 처리 장치Info
- Publication number
- KR20250153776A KR20250153776A KR1020257026941A KR20257026941A KR20250153776A KR 20250153776 A KR20250153776 A KR 20250153776A KR 1020257026941 A KR1020257026941 A KR 1020257026941A KR 20257026941 A KR20257026941 A KR 20257026941A KR 20250153776 A KR20250153776 A KR 20250153776A
- Authority
- KR
- South Korea
- Prior art keywords
- cavity
- wall member
- paragraph
- pipe member
- circumferential direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/166—Sealing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023024921 | 2023-02-21 | ||
| JPJP-P-2023-024921 | 2023-02-21 | ||
| PCT/JP2024/005562 WO2024176976A1 (ja) | 2023-02-21 | 2024-02-16 | 壁部材およびプラズマ処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250153776A true KR20250153776A (ko) | 2025-10-27 |
Family
ID=92501208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257026941A Pending KR20250153776A (ko) | 2023-02-21 | 2024-02-16 | 벽부재 및 플라즈마 처리 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250364232A1 (https=) |
| JP (1) | JP7770611B2 (https=) |
| KR (1) | KR20250153776A (https=) |
| CN (1) | CN120693683A (https=) |
| TW (1) | TW202507794A (https=) |
| WO (1) | WO2024176976A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011124362A (ja) | 2009-12-10 | 2011-06-23 | Tokyo Electron Ltd | プラズマ処理装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006093411A (ja) * | 2004-09-24 | 2006-04-06 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP5651317B2 (ja) | 2009-03-31 | 2015-01-07 | 東京エレクトロン株式会社 | 半導体製造装置及び温調方法 |
| JP7066512B2 (ja) * | 2018-05-11 | 2022-05-13 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7374016B2 (ja) * | 2019-06-18 | 2023-11-06 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP7519874B2 (ja) * | 2020-10-27 | 2024-07-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2024
- 2024-02-15 TW TW113105292A patent/TW202507794A/zh unknown
- 2024-02-16 KR KR1020257026941A patent/KR20250153776A/ko active Pending
- 2024-02-16 JP JP2025502338A patent/JP7770611B2/ja active Active
- 2024-02-16 CN CN202480012463.1A patent/CN120693683A/zh active Pending
- 2024-02-16 WO PCT/JP2024/005562 patent/WO2024176976A1/ja not_active Ceased
-
2025
- 2025-08-13 US US19/298,235 patent/US20250364232A1/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011124362A (ja) | 2009-12-10 | 2011-06-23 | Tokyo Electron Ltd | プラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024176976A1 (ja) | 2024-08-29 |
| CN120693683A (zh) | 2025-09-23 |
| JPWO2024176976A1 (https=) | 2024-08-29 |
| TW202507794A (zh) | 2025-02-16 |
| US20250364232A1 (en) | 2025-11-27 |
| JP7770611B2 (ja) | 2025-11-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13 | Application amended |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |