JP7770611B2 - 壁部材およびプラズマ処理装置 - Google Patents

壁部材およびプラズマ処理装置

Info

Publication number
JP7770611B2
JP7770611B2 JP2025502338A JP2025502338A JP7770611B2 JP 7770611 B2 JP7770611 B2 JP 7770611B2 JP 2025502338 A JP2025502338 A JP 2025502338A JP 2025502338 A JP2025502338 A JP 2025502338A JP 7770611 B2 JP7770611 B2 JP 7770611B2
Authority
JP
Japan
Prior art keywords
cavity
wall member
pipe member
member according
cooling gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025502338A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024176976A1 (https=
JPWO2024176976A5 (https=
Inventor
隆志 平
涼仁 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JPWO2024176976A1 publication Critical patent/JPWO2024176976A1/ja
Publication of JPWO2024176976A5 publication Critical patent/JPWO2024176976A5/ja
Application granted granted Critical
Publication of JP7770611B2 publication Critical patent/JP7770611B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32467—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/16—Vessels
    • H01J2237/166—Sealing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2025502338A 2023-02-21 2024-02-16 壁部材およびプラズマ処理装置 Active JP7770611B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023024921 2023-02-21
JP2023024921 2023-02-21
PCT/JP2024/005562 WO2024176976A1 (ja) 2023-02-21 2024-02-16 壁部材およびプラズマ処理装置

Publications (3)

Publication Number Publication Date
JPWO2024176976A1 JPWO2024176976A1 (https=) 2024-08-29
JPWO2024176976A5 JPWO2024176976A5 (https=) 2025-08-25
JP7770611B2 true JP7770611B2 (ja) 2025-11-14

Family

ID=92501208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025502338A Active JP7770611B2 (ja) 2023-02-21 2024-02-16 壁部材およびプラズマ処理装置

Country Status (6)

Country Link
US (1) US20250364232A1 (https=)
JP (1) JP7770611B2 (https=)
KR (1) KR20250153776A (https=)
CN (1) CN120693683A (https=)
TW (1) TW202507794A (https=)
WO (1) WO2024176976A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258404A (ja) 2009-03-31 2010-11-11 Tokyo Electron Ltd 半導体製造装置及び温調方法
JP2019197849A (ja) 2018-05-11 2019-11-14 東京エレクトロン株式会社 プラズマ処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093411A (ja) * 2004-09-24 2006-04-06 Hitachi Kokusai Electric Inc 基板処理装置
JP5396256B2 (ja) 2009-12-10 2014-01-22 東京エレクトロン株式会社 プラズマ処理装置
JP7374016B2 (ja) * 2019-06-18 2023-11-06 東京エレクトロン株式会社 基板処理装置
JP7519874B2 (ja) * 2020-10-27 2024-07-22 東京エレクトロン株式会社 プラズマ処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258404A (ja) 2009-03-31 2010-11-11 Tokyo Electron Ltd 半導体製造装置及び温調方法
JP2019197849A (ja) 2018-05-11 2019-11-14 東京エレクトロン株式会社 プラズマ処理装置

Also Published As

Publication number Publication date
WO2024176976A1 (ja) 2024-08-29
CN120693683A (zh) 2025-09-23
JPWO2024176976A1 (https=) 2024-08-29
TW202507794A (zh) 2025-02-16
US20250364232A1 (en) 2025-11-27
KR20250153776A (ko) 2025-10-27

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