JPWO2024171848A1 - - Google Patents

Info

Publication number
JPWO2024171848A1
JPWO2024171848A1 JP2025501060A JP2025501060A JPWO2024171848A1 JP WO2024171848 A1 JPWO2024171848 A1 JP WO2024171848A1 JP 2025501060 A JP2025501060 A JP 2025501060A JP 2025501060 A JP2025501060 A JP 2025501060A JP WO2024171848 A1 JPWO2024171848 A1 JP WO2024171848A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025501060A
Other languages
Japanese (ja)
Other versions
JPWO2024171848A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024171848A1 publication Critical patent/JPWO2024171848A1/ja
Publication of JPWO2024171848A5 publication Critical patent/JPWO2024171848A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
JP2025501060A 2023-02-14 2024-02-02 Pending JPWO2024171848A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023020562 2023-02-14
PCT/JP2024/003469 WO2024171848A1 (ja) 2023-02-14 2024-02-02 パワーモジュール、パワーモジュールの製造方法、および電力変換装置

Publications (2)

Publication Number Publication Date
JPWO2024171848A1 true JPWO2024171848A1 (https=) 2024-08-22
JPWO2024171848A5 JPWO2024171848A5 (https=) 2025-05-01

Family

ID=92421822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025501060A Pending JPWO2024171848A1 (https=) 2023-02-14 2024-02-02

Country Status (3)

Country Link
JP (1) JPWO2024171848A1 (https=)
CN (1) CN120677567A (https=)
WO (1) WO2024171848A1 (https=)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005015898A (ja) * 2003-06-27 2005-01-20 Seiko Epson Corp 装飾品の製造方法、装飾品および時計
JP2005277012A (ja) * 2004-03-24 2005-10-06 Mitsubishi Electric Corp 電力用半導体装置およびその製造方法
JP2006004961A (ja) * 2004-06-15 2006-01-05 Hitachi Ltd 半導体モジュール
JP2012138531A (ja) * 2010-12-28 2012-07-19 Sansha Electric Mfg Co Ltd 半導体パワーモジュール
JP2013008619A (ja) * 2011-06-27 2013-01-10 Fuji Electric Co Ltd 電子機器の端子装置
JP2013015195A (ja) * 2011-07-05 2013-01-24 Denso Corp 電力変換装置
JP2013077687A (ja) * 2011-09-30 2013-04-25 Shindengen Electric Mfg Co Ltd 半導体装置
JP2014090538A (ja) * 2012-10-29 2014-05-15 Denso Corp 電力変換装置
JP2015046416A (ja) * 2013-08-27 2015-03-12 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2015084609A (ja) * 2013-10-25 2015-04-30 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
JP2015128138A (ja) * 2013-11-27 2015-07-09 株式会社豊田自動織機 半導体装置
JP2016100940A (ja) * 2014-11-19 2016-05-30 株式会社ケーヒン 電力変換装置
JP2017219084A (ja) * 2016-06-06 2017-12-14 株式会社日立製作所 締結構造及び締結構造の収容部材
JP2018007429A (ja) * 2016-07-04 2018-01-11 アイシン精機株式会社 回転電機
WO2018097027A1 (ja) * 2016-11-24 2018-05-31 三菱電機株式会社 半導体装置およびその製造方法
JP2021022997A (ja) * 2019-07-25 2021-02-18 日産自動車株式会社 電気装置
JP2021158715A (ja) * 2020-03-25 2021-10-07 株式会社デンソー コンデンサ及びこれを備えた電力変換装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4118789B2 (ja) * 2003-11-25 2008-07-16 三菱電機株式会社 半導体装置用の外装樹脂ケース

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005015898A (ja) * 2003-06-27 2005-01-20 Seiko Epson Corp 装飾品の製造方法、装飾品および時計
JP2005277012A (ja) * 2004-03-24 2005-10-06 Mitsubishi Electric Corp 電力用半導体装置およびその製造方法
JP2006004961A (ja) * 2004-06-15 2006-01-05 Hitachi Ltd 半導体モジュール
JP2012138531A (ja) * 2010-12-28 2012-07-19 Sansha Electric Mfg Co Ltd 半導体パワーモジュール
JP2013008619A (ja) * 2011-06-27 2013-01-10 Fuji Electric Co Ltd 電子機器の端子装置
JP2013015195A (ja) * 2011-07-05 2013-01-24 Denso Corp 電力変換装置
JP2013077687A (ja) * 2011-09-30 2013-04-25 Shindengen Electric Mfg Co Ltd 半導体装置
JP2014090538A (ja) * 2012-10-29 2014-05-15 Denso Corp 電力変換装置
JP2015046416A (ja) * 2013-08-27 2015-03-12 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2015084609A (ja) * 2013-10-25 2015-04-30 三菱電機株式会社 接続導体の冷却装置及びそれを用いた電力変換装置
JP2015128138A (ja) * 2013-11-27 2015-07-09 株式会社豊田自動織機 半導体装置
JP2016100940A (ja) * 2014-11-19 2016-05-30 株式会社ケーヒン 電力変換装置
JP2017219084A (ja) * 2016-06-06 2017-12-14 株式会社日立製作所 締結構造及び締結構造の収容部材
JP2018007429A (ja) * 2016-07-04 2018-01-11 アイシン精機株式会社 回転電機
WO2018097027A1 (ja) * 2016-11-24 2018-05-31 三菱電機株式会社 半導体装置およびその製造方法
JP2021022997A (ja) * 2019-07-25 2021-02-18 日産自動車株式会社 電気装置
JP2021158715A (ja) * 2020-03-25 2021-10-07 株式会社デンソー コンデンサ及びこれを備えた電力変換装置

Also Published As

Publication number Publication date
WO2024171848A1 (ja) 2024-08-22
CN120677567A (zh) 2025-09-19

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