JPWO2024166181A1 - - Google Patents
Info
- Publication number
- JPWO2024166181A1 JPWO2024166181A1 JP2023574237A JP2023574237A JPWO2024166181A1 JP WO2024166181 A1 JPWO2024166181 A1 JP WO2024166181A1 JP 2023574237 A JP2023574237 A JP 2023574237A JP 2023574237 A JP2023574237 A JP 2023574237A JP WO2024166181 A1 JPWO2024166181 A1 JP WO2024166181A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/003830 WO2024166181A1 (ja) | 2023-02-06 | 2023-02-06 | サセプタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024166181A1 true JPWO2024166181A1 (https=) | 2024-08-15 |
| JPWO2024166181A5 JPWO2024166181A5 (https=) | 2025-01-15 |
| JP7667880B2 JP7667880B2 (ja) | 2025-04-23 |
Family
ID=92120080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023574237A Active JP7667880B2 (ja) | 2023-02-06 | 2023-02-06 | サセプタ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240266208A1 (https=) |
| JP (1) | JP7667880B2 (https=) |
| KR (1) | KR102810844B1 (https=) |
| CN (1) | CN120584400A (https=) |
| TW (1) | TW202435356A (https=) |
| WO (1) | WO2024166181A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005268654A (ja) * | 2004-03-19 | 2005-09-29 | Ngk Spark Plug Co Ltd | 静電チャック |
| WO2019187785A1 (ja) * | 2018-03-26 | 2019-10-03 | 日本碍子株式会社 | 静電チャックヒータ |
| JP2021048243A (ja) * | 2019-09-18 | 2021-03-25 | 新光電気工業株式会社 | 基板固定装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1485623A (en) * | 1973-11-05 | 1977-09-14 | Foseco Int | Treatment of droplet dispersions |
| US5968379A (en) * | 1995-07-14 | 1999-10-19 | Applied Materials, Inc. | High temperature ceramic heater assembly with RF capability and related methods |
| US5873781A (en) * | 1996-11-14 | 1999-02-23 | Bally Gaming International, Inc. | Gaming machine having truly random results |
| US6120608A (en) * | 1997-03-12 | 2000-09-19 | Applied Materials, Inc. | Workpiece support platen for semiconductor process chamber |
| US6494955B1 (en) * | 2000-02-15 | 2002-12-17 | Applied Materials, Inc. | Ceramic substrate support |
| WO2004112123A1 (ja) * | 2003-06-17 | 2004-12-23 | Creative Technology Corporation | 双極型静電チャック |
| JP5984504B2 (ja) * | 2012-05-21 | 2016-09-06 | 新光電気工業株式会社 | 静電チャック、静電チャックの製造方法 |
| US10770270B2 (en) * | 2016-06-07 | 2020-09-08 | Applied Materials, Inc. | High power electrostatic chuck with aperture-reducing plug in a gas hole |
| JP2019029384A (ja) * | 2017-07-25 | 2019-02-21 | 新光電気工業株式会社 | セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置 |
| WO2019082875A1 (ja) * | 2017-10-26 | 2019-05-02 | 京セラ株式会社 | 試料保持具 |
| US11367597B2 (en) * | 2018-07-05 | 2022-06-21 | Samsung Electronics Co., Ltd. | Electrostatic chuck and plasma processing apparatus including the same |
| US11626310B2 (en) * | 2018-10-30 | 2023-04-11 | Toto Ltd. | Electrostatic chuck |
| JP7402411B2 (ja) | 2018-10-30 | 2023-12-21 | Toto株式会社 | 静電チャック |
| CN111668148B (zh) * | 2019-03-05 | 2024-09-03 | Toto株式会社 | 静电吸盘及处理装置 |
| JP7441404B2 (ja) * | 2019-03-05 | 2024-03-01 | Toto株式会社 | 静電チャック、および処理装置 |
| JP7429208B2 (ja) * | 2021-08-17 | 2024-02-07 | 日本碍子株式会社 | ウエハ載置台 |
| JP7715464B2 (ja) * | 2021-09-02 | 2025-07-30 | 東京エレクトロン株式会社 | 基板処理装置 |
| US12341048B2 (en) * | 2021-11-29 | 2025-06-24 | Applied Materials, Inc. | Porous plug for electrostatic chuck gas delivery |
| JP7514817B2 (ja) * | 2021-12-27 | 2024-07-11 | 日本碍子株式会社 | 半導体製造装置用部材 |
| CN120513512A (zh) * | 2023-01-26 | 2025-08-19 | 日本碍子株式会社 | 晶片载放台 |
-
2023
- 2023-02-06 KR KR1020237041144A patent/KR102810844B1/ko active Active
- 2023-02-06 JP JP2023574237A patent/JP7667880B2/ja active Active
- 2023-02-06 WO PCT/JP2023/003830 patent/WO2024166181A1/ja not_active Ceased
- 2023-02-06 CN CN202380012007.2A patent/CN120584400A/zh active Pending
- 2023-11-28 US US18/520,716 patent/US20240266208A1/en active Pending
-
2024
- 2024-01-22 TW TW113102400A patent/TW202435356A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005268654A (ja) * | 2004-03-19 | 2005-09-29 | Ngk Spark Plug Co Ltd | 静電チャック |
| WO2019187785A1 (ja) * | 2018-03-26 | 2019-10-03 | 日本碍子株式会社 | 静電チャックヒータ |
| JP2021048243A (ja) * | 2019-09-18 | 2021-03-25 | 新光電気工業株式会社 | 基板固定装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240125844A (ko) | 2024-08-20 |
| WO2024166181A1 (ja) | 2024-08-15 |
| KR102810844B1 (ko) | 2025-05-22 |
| JP7667880B2 (ja) | 2025-04-23 |
| CN120584400A (zh) | 2025-09-02 |
| US20240266208A1 (en) | 2024-08-08 |
| TW202435356A (zh) | 2024-09-01 |
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