JPWO2024157518A1 - - Google Patents
Info
- Publication number
- JPWO2024157518A1 JPWO2024157518A1 JP2024509335A JP2024509335A JPWO2024157518A1 JP WO2024157518 A1 JPWO2024157518 A1 JP WO2024157518A1 JP 2024509335 A JP2024509335 A JP 2024509335A JP 2024509335 A JP2024509335 A JP 2024509335A JP WO2024157518 A1 JPWO2024157518 A1 JP WO2024157518A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPPCT/JP2023/002417 | 2023-01-26 | ||
| JP2023002417 | 2023-01-26 | ||
| PCT/JP2023/031890 WO2024157518A1 (ja) | 2023-01-26 | 2023-08-31 | ウエハ載置台 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024157518A1 true JPWO2024157518A1 (https=) | 2024-08-02 |
| JPWO2024157518A5 JPWO2024157518A5 (https=) | 2024-12-24 |
| JP7618098B2 JP7618098B2 (ja) | 2025-01-20 |
Family
ID=91970183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024509335A Active JP7618098B2 (ja) | 2023-01-26 | 2023-08-31 | ウエハ載置台 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240297062A1 (https=) |
| JP (1) | JP7618098B2 (https=) |
| KR (1) | KR102772614B1 (https=) |
| CN (1) | CN120513512A (https=) |
| TW (1) | TW202431469A (https=) |
| WO (1) | WO2024157518A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102810844B1 (ko) * | 2023-02-06 | 2025-05-22 | 엔지케이 인슐레이터 엘티디 | 서셉터 |
| WO2026058633A1 (ja) * | 2024-09-12 | 2026-03-19 | 日本碍子株式会社 | ウエハ載置台 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019519927A (ja) * | 2016-06-07 | 2019-07-11 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | ガス孔に開口縮小プラグを有する大電力静電チャック |
| JP2020150071A (ja) * | 2019-03-12 | 2020-09-17 | 新光電気工業株式会社 | 基板固定装置 |
| WO2021241645A1 (ja) * | 2020-05-28 | 2021-12-02 | 京セラ株式会社 | 通気性プラグ、基板支持アセンブリおよびシャワープレート |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090097229A (ko) * | 2008-03-11 | 2009-09-16 | 전영재 | 반도체 및 ｌｃｄ 제조용 정전척 |
| US8336891B2 (en) * | 2008-03-11 | 2012-12-25 | Ngk Insulators, Ltd. | Electrostatic chuck |
| JP5984504B2 (ja) * | 2012-05-21 | 2016-09-06 | 新光電気工業株式会社 | 静電チャック、静電チャックの製造方法 |
| JP5633766B2 (ja) * | 2013-03-29 | 2014-12-03 | Toto株式会社 | 静電チャック |
| US10688750B2 (en) * | 2017-10-03 | 2020-06-23 | Applied Materials, Inc. | Bonding structure of E chuck to aluminum base configuration |
| KR102188779B1 (ko) * | 2018-10-15 | 2020-12-08 | 세메스 주식회사 | 기판 지지 장치 및 그 제조방법 |
| JP7402411B2 (ja) | 2018-10-30 | 2023-12-21 | Toto株式会社 | 静電チャック |
| JP7600025B2 (ja) * | 2021-04-23 | 2024-12-16 | 新光電気工業株式会社 | 静電吸着部材及び基板固定装置 |
-
2023
- 2023-08-31 CN CN202380013320.8A patent/CN120513512A/zh active Pending
- 2023-08-31 WO PCT/JP2023/031890 patent/WO2024157518A1/ja not_active Ceased
- 2023-08-31 KR KR1020247008103A patent/KR102772614B1/ko active Active
- 2023-08-31 JP JP2024509335A patent/JP7618098B2/ja active Active
- 2023-09-13 TW TW112134834A patent/TW202431469A/zh unknown
-
2024
- 2024-02-21 US US18/582,759 patent/US20240297062A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019519927A (ja) * | 2016-06-07 | 2019-07-11 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | ガス孔に開口縮小プラグを有する大電力静電チャック |
| JP2020150071A (ja) * | 2019-03-12 | 2020-09-17 | 新光電気工業株式会社 | 基板固定装置 |
| WO2021241645A1 (ja) * | 2020-05-28 | 2021-12-02 | 京セラ株式会社 | 通気性プラグ、基板支持アセンブリおよびシャワープレート |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102772614B1 (ko) | 2025-02-26 |
| JP7618098B2 (ja) | 2025-01-20 |
| US20240297062A1 (en) | 2024-09-05 |
| WO2024157518A1 (ja) | 2024-08-02 |
| CN120513512A (zh) | 2025-08-19 |
| KR20240119246A (ko) | 2024-08-06 |
| TW202431469A (zh) | 2024-08-01 |
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