CN120513512A - 晶片载放台 - Google Patents

晶片载放台

Info

Publication number
CN120513512A
CN120513512A CN202380013320.8A CN202380013320A CN120513512A CN 120513512 A CN120513512 A CN 120513512A CN 202380013320 A CN202380013320 A CN 202380013320A CN 120513512 A CN120513512 A CN 120513512A
Authority
CN
China
Prior art keywords
conductive
gas
plug
gas passing
ceramic plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380013320.8A
Other languages
English (en)
Chinese (zh)
Inventor
井上靖也
久野达也
石川征树
宇佐美太朗
中村镰
平田夏树
米本宪司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN120513512A publication Critical patent/CN120513512A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202380013320.8A 2023-01-26 2023-08-31 晶片载放台 Pending CN120513512A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2023/002417 2023-01-26
JP2023002417 2023-01-26
PCT/JP2023/031890 WO2024157518A1 (ja) 2023-01-26 2023-08-31 ウエハ載置台

Publications (1)

Publication Number Publication Date
CN120513512A true CN120513512A (zh) 2025-08-19

Family

ID=91970183

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380013320.8A Pending CN120513512A (zh) 2023-01-26 2023-08-31 晶片载放台

Country Status (6)

Country Link
US (1) US20240297062A1 (https=)
JP (1) JP7618098B2 (https=)
KR (1) KR102772614B1 (https=)
CN (1) CN120513512A (https=)
TW (1) TW202431469A (https=)
WO (1) WO2024157518A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102810844B1 (ko) * 2023-02-06 2025-05-22 엔지케이 인슐레이터 엘티디 서셉터
WO2026058633A1 (ja) * 2024-09-12 2026-03-19 日本碍子株式会社 ウエハ載置台

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090097229A (ko) * 2008-03-11 2009-09-16 전영재 반도체 및 ｌｃｄ 제조용 정전척
US8336891B2 (en) * 2008-03-11 2012-12-25 Ngk Insulators, Ltd. Electrostatic chuck
JP5984504B2 (ja) * 2012-05-21 2016-09-06 新光電気工業株式会社 静電チャック、静電チャックの製造方法
JP5633766B2 (ja) * 2013-03-29 2014-12-03 Toto株式会社 静電チャック
US10770270B2 (en) * 2016-06-07 2020-09-08 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
US10688750B2 (en) * 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
KR102188779B1 (ko) * 2018-10-15 2020-12-08 세메스 주식회사 기판 지지 장치 및 그 제조방법
JP7402411B2 (ja) 2018-10-30 2023-12-21 Toto株式会社 静電チャック
JP7269759B2 (ja) 2019-03-12 2023-05-09 新光電気工業株式会社 基板固定装置
WO2021241645A1 (ja) * 2020-05-28 2021-12-02 京セラ株式会社 通気性プラグ、基板支持アセンブリおよびシャワープレート
JP7600025B2 (ja) * 2021-04-23 2024-12-16 新光電気工業株式会社 静電吸着部材及び基板固定装置

Also Published As

Publication number Publication date
KR102772614B1 (ko) 2025-02-26
JP7618098B2 (ja) 2025-01-20
US20240297062A1 (en) 2024-09-05
JPWO2024157518A1 (https=) 2024-08-02
WO2024157518A1 (ja) 2024-08-02
KR20240119246A (ko) 2024-08-06
TW202431469A (zh) 2024-08-01

Similar Documents

Publication Publication Date Title
TWI832114B (zh) 半導體製造裝置用構件及其製造方法
CN120513512A (zh) 晶片载放台
TWI912585B (zh) 晶圓載置台
US20250336655A1 (en) Wafer placement table
CN114628308B (zh) 半导体制造装置用构件及其制法
CN115954252B (zh) 晶片载放台
US20250014875A1 (en) Wafer placement table
US20240355656A1 (en) Wafer placement table
CN120642045A (zh) 晶片载放台
JP7776669B1 (ja) ウエハ載置台
WO2024004040A1 (ja) ウエハ載置台
WO2023063016A1 (ja) ウエハ載置台
CN120709220A (zh) 晶片载放台
JP7747847B1 (ja) ウエハ載置台
JP7781314B1 (ja) 半導体製造装置用部材
WO2026058633A1 (ja) ウエハ載置台

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination