JPWO2024143541A5 - - Google Patents
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- Publication number
- JPWO2024143541A5 JPWO2024143541A5 JP2024567982A JP2024567982A JPWO2024143541A5 JP WO2024143541 A5 JPWO2024143541 A5 JP WO2024143541A5 JP 2024567982 A JP2024567982 A JP 2024567982A JP 2024567982 A JP2024567982 A JP 2024567982A JP WO2024143541 A5 JPWO2024143541 A5 JP WO2024143541A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- main
- semiconductor device
- main electrode
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 193
- 239000000758 substrate Substances 0.000 claims description 72
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000000565 sealant Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022211688 | 2022-12-28 | ||
| JP2023102768 | 2023-06-22 | ||
| PCT/JP2023/047275 WO2024143541A1 (ja) | 2022-12-28 | 2023-12-28 | 半導体デバイス、半導体モジュール、および製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024143541A1 JPWO2024143541A1 (https=) | 2024-07-04 |
| JPWO2024143541A5 true JPWO2024143541A5 (https=) | 2025-02-17 |
Family
ID=91717904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567982A Pending JPWO2024143541A1 (https=) | 2022-12-28 | 2023-12-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250112143A1 (https=) |
| JP (1) | JPWO2024143541A1 (https=) |
| CN (1) | CN119301761A (https=) |
| DE (1) | DE112023001619T5 (https=) |
| WO (1) | WO2024143541A1 (https=) |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710748U (https=) * | 1980-06-18 | 1982-01-20 | ||
| JPH0436230Y2 (https=) * | 1985-12-19 | 1992-08-26 | ||
| JPH1050926A (ja) * | 1996-07-31 | 1998-02-20 | Taiyo Yuden Co Ltd | ハイブリッドモジュール |
| JP2001166032A (ja) * | 1999-12-06 | 2001-06-22 | Nec Corp | 電波放射制御装置及び電波放射制御方法 |
| JP3923258B2 (ja) * | 2001-01-17 | 2007-05-30 | 松下電器産業株式会社 | 電力制御系電子回路装置及びその製造方法 |
| JP2006303006A (ja) * | 2005-04-18 | 2006-11-02 | Yaskawa Electric Corp | パワーモジュール |
| DE102007036841B4 (de) * | 2007-08-06 | 2018-05-09 | Infineon Technologies Ag | Halbleiterbauteil mit Halbleiterchip und Verfahren zu dessen Herstellung |
| JP2009224534A (ja) * | 2008-03-17 | 2009-10-01 | Yaskawa Electric Corp | パワーモジュール |
| US7816784B2 (en) * | 2008-12-17 | 2010-10-19 | Fairchild Semiconductor Corporation | Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same |
| WO2010147202A1 (ja) * | 2009-06-19 | 2010-12-23 | 株式会社安川電機 | 電力変換装置 |
| WO2014046058A1 (ja) * | 2012-09-20 | 2014-03-27 | ローム株式会社 | パワーモジュール半導体装置およびインバータ装置、およびパワーモジュール半導体装置の製造方法、および金型 |
| US9012990B2 (en) * | 2012-10-17 | 2015-04-21 | International Rectifier Corporation | Surface mountable power components |
| JP5975856B2 (ja) * | 2012-11-27 | 2016-08-23 | 三菱電機株式会社 | 電力用半導体装置 |
| US9214416B1 (en) * | 2013-06-22 | 2015-12-15 | Courtney Furnival | High speed, low loss and high density power semiconductor packages (μMaxPak) with molded surface mount high speed device(s) and multi-chip architectures |
| US9508625B2 (en) * | 2014-04-01 | 2016-11-29 | Infineon Technologies Ag | Semiconductor die package with multiple mounting configurations |
| SG10201504271YA (en) * | 2015-05-29 | 2016-12-29 | Delta Electronics Int’L Singapore Pte Ltd | Power module |
| SG10201508520PA (en) * | 2015-10-14 | 2017-05-30 | Delta Electronics Int’L Singapore Pte Ltd | Power module |
| DE112018003873T5 (de) * | 2017-04-24 | 2020-04-23 | Rohm Co., Ltd. | Elektronische komponente und halbleitervorrichtung |
| US11075137B2 (en) * | 2018-05-02 | 2021-07-27 | Semiconductor Components Industries, Llc | High power module package structures |
| JP7510764B2 (ja) * | 2020-01-30 | 2024-07-04 | ローム株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2021174847A (ja) * | 2020-04-23 | 2021-11-01 | 株式会社デンソー | 電子機器 |
| CN112864139A (zh) * | 2020-12-31 | 2021-05-28 | 华进半导体封装先导技术研发中心有限公司 | 一种功率器件封装结构及其制造方法、电子装置 |
-
2023
- 2023-12-28 JP JP2024567982A patent/JPWO2024143541A1/ja active Pending
- 2023-12-28 WO PCT/JP2023/047275 patent/WO2024143541A1/ja not_active Ceased
- 2023-12-28 CN CN202380042617.7A patent/CN119301761A/zh active Pending
- 2023-12-28 DE DE112023001619.4T patent/DE112023001619T5/de active Pending
-
2024
- 2024-11-24 US US18/957,825 patent/US20250112143A1/en active Pending
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