JPWO2024128039A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2024128039A5 JPWO2024128039A5 JP2024564286A JP2024564286A JPWO2024128039A5 JP WO2024128039 A5 JPWO2024128039 A5 JP WO2024128039A5 JP 2024564286 A JP2024564286 A JP 2024564286A JP 2024564286 A JP2024564286 A JP 2024564286A JP WO2024128039 A5 JPWO2024128039 A5 JP WO2024128039A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- substrate
- land
- view
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022197889 | 2022-12-12 | ||
| JP2022197889 | 2022-12-12 | ||
| PCT/JP2023/043158 WO2024128039A1 (ja) | 2022-12-12 | 2023-12-01 | Rfidタグ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024128039A1 JPWO2024128039A1 (https=) | 2024-06-20 |
| JPWO2024128039A5 true JPWO2024128039A5 (https=) | 2025-05-27 |
| JP7786616B2 JP7786616B2 (ja) | 2025-12-16 |
Family
ID=91485684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024564286A Active JP7786616B2 (ja) | 2022-12-12 | 2023-12-01 | Rfidタグ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250225362A1 (https=) |
| JP (1) | JP7786616B2 (https=) |
| DE (1) | DE212023000396U1 (https=) |
| WO (1) | WO2024128039A1 (https=) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10333200B2 (en) * | 2015-02-17 | 2019-06-25 | Samsung Electronics Co., Ltd. | Portable device and near field communication chip |
| EP4053742A4 (en) * | 2019-10-28 | 2023-11-22 | Kyocera Corporation | SUBSTRATE FOR RFID LABELS, RFID LABEL AND RFID SYSTEM |
-
2023
- 2023-12-01 DE DE212023000396.1U patent/DE212023000396U1/de active Active
- 2023-12-01 JP JP2024564286A patent/JP7786616B2/ja active Active
- 2023-12-01 WO PCT/JP2023/043158 patent/WO2024128039A1/ja not_active Ceased
-
2025
- 2025-03-26 US US19/090,933 patent/US20250225362A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH11354702A5 (https=) | ||
| KR970703617A (ko) | 전도선을 가진 리드프레임 리드를 포함한 고밀도 집적회로 조립체(a high density integrated circuit assembly combining leadframe leads with conductive traces) | |
| JPH079953B2 (ja) | 半導体装置の製造方法 | |
| JPWO2024128039A5 (https=) | ||
| US6621166B2 (en) | Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging | |
| CN206774530U (zh) | 用于双基岛封装电路的引线框架 | |
| TWI362097B (en) | Semiconductor package with wire-bonding on multi-zigzag fingers | |
| CN212113711U (zh) | 一种引线框架及to封装结构 | |
| JPH023621Y2 (https=) | ||
| US20030141581A1 (en) | Integrated circuit package stacking structure | |
| JP2007180077A5 (https=) | ||
| CN214852021U (zh) | 电路板、电路板组件以及电子装置 | |
| JP2004031561A5 (https=) | ||
| JP4810033B2 (ja) | アンテナコイル及びそれを用いた非接触型カード | |
| JPWO2024080331A5 (https=) | ||
| JP2005150294A5 (https=) | ||
| CN201256149Y (zh) | 集成电路组件堆栈结构 | |
| JPS5851527A (ja) | 半導体装置 | |
| JPWO2024048718A5 (https=) | ||
| JPH01287903A (ja) | 積層型シートコイル | |
| JPWO2024048715A5 (https=) | ||
| JPH057769Y2 (https=) | ||
| TWI228310B (en) | Manufacture method of stacked semiconductor device | |
| JPS63147835U (https=) | ||
| JPH0631154U (ja) | 複合半導体装置 |