JPWO2024100973A5 - - Google Patents
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- Publication number
- JPWO2024100973A5 JPWO2024100973A5 JP2024557036A JP2024557036A JPWO2024100973A5 JP WO2024100973 A5 JPWO2024100973 A5 JP WO2024100973A5 JP 2024557036 A JP2024557036 A JP 2024557036A JP 2024557036 A JP2024557036 A JP 2024557036A JP WO2024100973 A5 JPWO2024100973 A5 JP WO2024100973A5
- Authority
- JP
- Japan
- Prior art keywords
- shoulder
- horizontal portion
- curvature
- radius
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims 12
- 238000007747 plating Methods 0.000 claims 7
- 239000003985 ceramic capacitor Substances 0.000 claims 6
- 239000002344 surface layer Substances 0.000 claims 6
- 238000003475 lamination Methods 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022180344 | 2022-11-10 | ||
| PCT/JP2023/032095 WO2024100973A1 (ja) | 2022-11-10 | 2023-09-01 | 積層セラミックコンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024100973A1 JPWO2024100973A1 (https=) | 2024-05-16 |
| JPWO2024100973A5 true JPWO2024100973A5 (https=) | 2025-05-02 |
Family
ID=91032159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024557036A Pending JPWO2024100973A1 (https=) | 2022-11-10 | 2023-09-01 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240355551A1 (https=) |
| JP (1) | JPWO2024100973A1 (https=) |
| CN (1) | CN119948583A (https=) |
| WO (1) | WO2024100973A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3831497B2 (ja) * | 1997-10-06 | 2006-10-11 | Ｔｄｋ株式会社 | Ｃｒ複合電子部品とその製造方法 |
| JP2007281212A (ja) * | 2006-04-07 | 2007-10-25 | Matsushita Electric Ind Co Ltd | チップ型電子部品とその製造方法 |
| JP4586835B2 (ja) * | 2007-08-22 | 2010-11-24 | Ｔｄｋ株式会社 | 電子部品の製造方法 |
| KR20140041022A (ko) * | 2012-09-27 | 2014-04-04 | 삼성전기주식회사 | 칩 소자 및 그 제조 방법 |
| JP2017011142A (ja) * | 2015-06-24 | 2017-01-12 | Tdk株式会社 | セラミック電子部品 |
| JP7510741B2 (ja) * | 2018-08-23 | 2024-07-04 | 太陽誘電株式会社 | 積層セラミック電子部品の製造方法 |
| JP7471040B2 (ja) * | 2021-02-01 | 2024-04-19 | Tdk株式会社 | 電子部品 |
-
2023
- 2023-09-01 JP JP2024557036A patent/JPWO2024100973A1/ja active Pending
- 2023-09-01 CN CN202380069009.5A patent/CN119948583A/zh active Pending
- 2023-09-01 WO PCT/JP2023/032095 patent/WO2024100973A1/ja not_active Ceased
-
2024
- 2024-07-01 US US18/760,077 patent/US20240355551A1/en active Pending
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