JPWO2024100973A1 - - Google Patents
Info
- Publication number
- JPWO2024100973A1 JPWO2024100973A1 JP2024557036A JP2024557036A JPWO2024100973A1 JP WO2024100973 A1 JPWO2024100973 A1 JP WO2024100973A1 JP 2024557036 A JP2024557036 A JP 2024557036A JP 2024557036 A JP2024557036 A JP 2024557036A JP WO2024100973 A1 JPWO2024100973 A1 JP WO2024100973A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022180344 | 2022-11-10 | ||
| PCT/JP2023/032095 WO2024100973A1 (ja) | 2022-11-10 | 2023-09-01 | 積層セラミックコンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024100973A1 true JPWO2024100973A1 (https=) | 2024-05-16 |
| JPWO2024100973A5 JPWO2024100973A5 (https=) | 2025-05-02 |
Family
ID=91032159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024557036A Pending JPWO2024100973A1 (https=) | 2022-11-10 | 2023-09-01 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240355551A1 (https=) |
| JP (1) | JPWO2024100973A1 (https=) |
| CN (1) | CN119948583A (https=) |
| WO (1) | WO2024100973A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020031152A (ja) * | 2018-08-23 | 2020-02-27 | 太陽誘電株式会社 | 積層セラミック電子部品、積層セラミック電子部品実装基板及び積層セラミック電子部品包装体並びに積層セラミック電子部品の製造方法 |
| JP2022117648A (ja) * | 2021-02-01 | 2022-08-12 | Tdk株式会社 | 電子部品 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3831497B2 (ja) * | 1997-10-06 | 2006-10-11 | Ｔｄｋ株式会社 | Ｃｒ複合電子部品とその製造方法 |
| JP2007281212A (ja) * | 2006-04-07 | 2007-10-25 | Matsushita Electric Ind Co Ltd | チップ型電子部品とその製造方法 |
| JP4586835B2 (ja) * | 2007-08-22 | 2010-11-24 | Ｔｄｋ株式会社 | 電子部品の製造方法 |
| KR20140041022A (ko) * | 2012-09-27 | 2014-04-04 | 삼성전기주식회사 | 칩 소자 및 그 제조 방법 |
| JP2017011142A (ja) * | 2015-06-24 | 2017-01-12 | Tdk株式会社 | セラミック電子部品 |
-
2023
- 2023-09-01 JP JP2024557036A patent/JPWO2024100973A1/ja active Pending
- 2023-09-01 CN CN202380069009.5A patent/CN119948583A/zh active Pending
- 2023-09-01 WO PCT/JP2023/032095 patent/WO2024100973A1/ja not_active Ceased
-
2024
- 2024-07-01 US US18/760,077 patent/US20240355551A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020031152A (ja) * | 2018-08-23 | 2020-02-27 | 太陽誘電株式会社 | 積層セラミック電子部品、積層セラミック電子部品実装基板及び積層セラミック電子部品包装体並びに積層セラミック電子部品の製造方法 |
| JP2022117648A (ja) * | 2021-02-01 | 2022-08-12 | Tdk株式会社 | 電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240355551A1 (en) | 2024-10-24 |
| CN119948583A (zh) | 2025-05-06 |
| WO2024100973A1 (ja) | 2024-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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| A521 | Request for written amendment filed |
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