JPWO2024038658A5 - - Google Patents
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- Publication number
- JPWO2024038658A5 JPWO2024038658A5 JP2024541427A JP2024541427A JPWO2024038658A5 JP WO2024038658 A5 JPWO2024038658 A5 JP WO2024038658A5 JP 2024541427 A JP2024541427 A JP 2024541427A JP 2024541427 A JP2024541427 A JP 2024541427A JP WO2024038658 A5 JPWO2024038658 A5 JP WO2024038658A5
- Authority
- JP
- Japan
- Prior art keywords
- surface portion
- main surface
- length
- laminate
- external electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022130759 | 2022-08-18 | ||
| PCT/JP2023/020658 WO2024038658A1 (ja) | 2022-08-18 | 2023-06-02 | 積層セラミックコンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024038658A1 JPWO2024038658A1 (https=) | 2024-02-22 |
| JPWO2024038658A5 true JPWO2024038658A5 (https=) | 2025-04-23 |
Family
ID=89941792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024541427A Pending JPWO2024038658A1 (https=) | 2022-08-18 | 2023-06-02 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240304389A1 (https=) |
| JP (1) | JPWO2024038658A1 (https=) |
| CN (1) | CN119317985A (https=) |
| WO (1) | WO2024038658A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7794323B2 (ja) * | 2022-08-18 | 2026-01-06 | 株式会社村田製作所 | 積層セラミックコンデンサ |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09153430A (ja) * | 1995-11-30 | 1997-06-10 | Taiyo Yuden Co Ltd | チップ状回路部品とその製造方法 |
| JP2003051423A (ja) * | 2001-08-03 | 2003-02-21 | Tdk Corp | 電子部品 |
| JP3873728B2 (ja) * | 2001-12-05 | 2007-01-24 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
| JP4378370B2 (ja) * | 2006-09-25 | 2009-12-02 | Ｔｄｋ株式会社 | 積層コンデンサ |
| KR101701022B1 (ko) * | 2015-01-20 | 2017-01-31 | 삼성전기주식회사 | 적층 세라믹 전자부품, 그 제조방법 및 전자부품이 실장된 회로기판 |
| JP7308021B2 (ja) * | 2018-10-12 | 2023-07-13 | 太陽誘電株式会社 | セラミック電子部品、セラミック電子部品の製造方法およびセラミック電子部品実装回路基板 |
| JP7567757B2 (ja) * | 2021-11-16 | 2024-10-16 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP2023135456A (ja) * | 2022-03-15 | 2023-09-28 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP7794323B2 (ja) * | 2022-08-18 | 2026-01-06 | 株式会社村田製作所 | 積層セラミックコンデンサ |
-
2023
- 2023-06-02 WO PCT/JP2023/020658 patent/WO2024038658A1/ja not_active Ceased
- 2023-06-02 JP JP2024541427A patent/JPWO2024038658A1/ja active Pending
- 2023-06-02 CN CN202380044754.4A patent/CN119317985A/zh active Pending
-
2024
- 2024-05-16 US US18/665,829 patent/US20240304389A1/en active Pending
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