JPWO2024069888A5 - - Google Patents

Info

Publication number
JPWO2024069888A5
JPWO2024069888A5 JP2024548992A JP2024548992A JPWO2024069888A5 JP WO2024069888 A5 JPWO2024069888 A5 JP WO2024069888A5 JP 2024548992 A JP2024548992 A JP 2024548992A JP 2024548992 A JP2024548992 A JP 2024548992A JP WO2024069888 A5 JPWO2024069888 A5 JP WO2024069888A5
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
copper plate
integrated
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024548992A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024069888A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/036557 external-priority patent/WO2024069888A1/ja
Publication of JPWO2024069888A1 publication Critical patent/JPWO2024069888A1/ja
Publication of JPWO2024069888A5 publication Critical patent/JPWO2024069888A5/ja
Pending legal-status Critical Current

Links

JP2024548992A 2022-09-29 2022-09-29 Pending JPWO2024069888A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/036557 WO2024069888A1 (ja) 2022-09-29 2022-09-29 半導体装置用基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024069888A1 JPWO2024069888A1 (https=) 2024-04-04
JPWO2024069888A5 true JPWO2024069888A5 (https=) 2025-10-10

Family

ID=90476904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024548992A Pending JPWO2024069888A1 (https=) 2022-09-29 2022-09-29

Country Status (4)

Country Link
JP (1) JPWO2024069888A1 (https=)
CN (1) CN120019488A (https=)
DE (1) DE112022007831T5 (https=)
WO (1) WO2024069888A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200927481A (en) * 2007-12-18 2009-07-01 Wen-Jung Jiang Method of producing ceramic-copper foil laminated board
CN103113126A (zh) * 2011-11-17 2013-05-22 上海申和热磁电子有限公司 湿法氧化铜片烧结直接敷铜的方法
CN112533388B (zh) * 2019-09-19 2022-10-18 比亚迪股份有限公司 陶瓷覆铜板及其制备方法
CN114230359B (zh) * 2020-09-09 2023-03-14 比亚迪股份有限公司 一种陶瓷覆铜板及其制备方法
JP7251001B2 (ja) * 2020-12-04 2023-04-03 Ｎｇｋエレクトロデバイス株式会社 セラミック焼結体及び半導体装置用基板

Similar Documents

Publication Publication Date Title
TWI689072B (zh) 針對用於半導體封裝的矽橋的傳導墊層之交替表面
CN118476024A (zh) 用于堆叠管芯的热旁路
US20160196988A1 (en) Embedded semiconductive chips in reconstituted wafers, and systems containing same
TW200507193A (en) Adhesive sheet for dicing and die bonding and method of manufacturing semiconductor device
TW201133773A (en) 3DIC architecture with die inside interposer
TW200644218A (en) Multi-chip module and method of manufacture
JP2004282072A5 (https=)
JP2005340423A5 (https=)
TW200636892A (en) Semiconductor device and its method for manufacturing
JP2017092464A5 (https=)
CN107611111A (zh) 半导体模块、电力转换装置
JP2006033093A5 (https=)
TW200703729A (en) Method for preparing light emitting diode device having heat dissipation rate enhancement
TWI633636B (zh) 電子裝置及其製造方法
JP2006019429A5 (https=)
WO2013064592A3 (en) Wafer scale technique for interconnecting vertically stacked semiconductor dies
NL1027869A1 (nl) Multi-chipverpakking.
JPWO2024069888A5 (https=)
JP2010287866A5 (https=)
CN101192551B (zh) 金/硅共晶芯片键合方法
TWI269419B (en) Method for forming wafer-level heat spreader structure and packaging structure thereof
ITMI20091294A1 (it) Modulo a semiconduttore e un procedimento per la produzione di un circuito elettronico
JP2020515051A5 (https=)
JP2009194388A5 (https=)
TW200802834A (en) Semiconductor device and method for making same