JPWO2024062560A1 - - Google Patents

Info

Publication number
JPWO2024062560A1
JPWO2024062560A1 JP2024547997A JP2024547997A JPWO2024062560A1 JP WO2024062560 A1 JPWO2024062560 A1 JP WO2024062560A1 JP 2024547997 A JP2024547997 A JP 2024547997A JP 2024547997 A JP2024547997 A JP 2024547997A JP WO2024062560 A1 JPWO2024062560 A1 JP WO2024062560A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024547997A
Other languages
Japanese (ja)
Other versions
JPWO2024062560A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024062560A1 publication Critical patent/JPWO2024062560A1/ja
Publication of JPWO2024062560A5 publication Critical patent/JPWO2024062560A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2024547997A 2022-09-21 2022-09-21 Pending JPWO2024062560A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/035189 WO2024062560A1 (ja) 2022-09-21 2022-09-21 プローブカード用プローブ

Publications (2)

Publication Number Publication Date
JPWO2024062560A1 true JPWO2024062560A1 (https=) 2024-03-28
JPWO2024062560A5 JPWO2024062560A5 (https=) 2025-04-30

Family

ID=90454009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024547997A Pending JPWO2024062560A1 (https=) 2022-09-21 2022-09-21

Country Status (6)

Country Link
US (1) US20260050010A1 (https=)
JP (1) JPWO2024062560A1 (https=)
KR (1) KR20250048368A (https=)
CN (1) CN119923567A (https=)
TW (1) TWI866465B (https=)
WO (1) WO2024062560A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007029791A1 (ja) * 2005-09-09 2007-03-15 Nhk Spring Co., Ltd. 導電性接触子および導電性接触子の製造方法
US20090315578A1 (en) * 2008-06-18 2009-12-24 Star Technologies Inc. Probe and probe card for integrated circuit devices using the same
JP2014510283A (ja) * 2011-03-21 2014-04-24 フォームファクター， インコーポレイテッド 非線形垂直板バネ
US20150015287A1 (en) * 2013-07-11 2015-01-15 Johnstech International Corporation Testing apparatus and method for microcircuit and wafer level ic testing
JP2018515752A (ja) * 2015-03-31 2018-06-14 テクノプローベ エス．ピー．エー． 高周波適用のためのバーチカル接触プローブ、及びバーチカル接触プローブをもつ試験ヘッド
US20190064215A1 (en) * 2017-08-23 2019-02-28 Leeno Industrial Inc. Mems probe and test device using the same
WO2024062558A1 (ja) * 2022-09-21 2024-03-28 日本電子材料株式会社 プローブカード用プローブ
JP7470860B2 (ja) * 2021-03-16 2024-04-18 日本電子材料株式会社 プローブカード用プローブおよびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3768305B2 (ja) * 1996-10-22 2006-04-19 株式会社日本マイクロニクス 平板状被検査体検査用プローブユニット
EP1610131A1 (en) * 2004-06-21 2005-12-28 Capres A/S Flexible probe
JP2006284292A (ja) * 2005-03-31 2006-10-19 Kanai Hiroaki コンタクトプローブ構造体
US7384277B1 (en) * 2006-12-17 2008-06-10 Formfactor, Inc. Reinforced contact elements
JP2014013184A (ja) * 2012-07-04 2014-01-23 Micronics Japan Co Ltd カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット
IT202000030194A1 (it) * 2020-12-09 2022-06-09 Technoprobe Spa Sonda di contatto per teste di misura di dispositivi elettronici e relativa testa di misura

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007029791A1 (ja) * 2005-09-09 2007-03-15 Nhk Spring Co., Ltd. 導電性接触子および導電性接触子の製造方法
US20090315578A1 (en) * 2008-06-18 2009-12-24 Star Technologies Inc. Probe and probe card for integrated circuit devices using the same
JP2014510283A (ja) * 2011-03-21 2014-04-24 フォームファクター， インコーポレイテッド 非線形垂直板バネ
US20150015287A1 (en) * 2013-07-11 2015-01-15 Johnstech International Corporation Testing apparatus and method for microcircuit and wafer level ic testing
JP2018515752A (ja) * 2015-03-31 2018-06-14 テクノプローベ エス．ピー．エー． 高周波適用のためのバーチカル接触プローブ、及びバーチカル接触プローブをもつ試験ヘッド
US20190064215A1 (en) * 2017-08-23 2019-02-28 Leeno Industrial Inc. Mems probe and test device using the same
JP7470860B2 (ja) * 2021-03-16 2024-04-18 日本電子材料株式会社 プローブカード用プローブおよびその製造方法
WO2024062558A1 (ja) * 2022-09-21 2024-03-28 日本電子材料株式会社 プローブカード用プローブ

Also Published As

Publication number Publication date
CN119923567A (zh) 2025-05-02
WO2024062560A1 (ja) 2024-03-28
TWI866465B (zh) 2024-12-11
KR20250048368A (ko) 2025-04-08
US20260050010A1 (en) 2026-02-19
TW202429090A (zh) 2024-07-16

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