KR20250048368A - 프로브 카드용 프로브 - Google Patents
프로브 카드용 프로브 Download PDFInfo
- Publication number
- KR20250048368A KR20250048368A KR1020257008795A KR20257008795A KR20250048368A KR 20250048368 A KR20250048368 A KR 20250048368A KR 1020257008795 A KR1020257008795 A KR 1020257008795A KR 20257008795 A KR20257008795 A KR 20257008795A KR 20250048368 A KR20250048368 A KR 20250048368A
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- probe card
- card
- metal layer
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/035189 WO2024062560A1 (ja) | 2022-09-21 | 2022-09-21 | プローブカード用プローブ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250048368A true KR20250048368A (ko) | 2025-04-08 |
Family
ID=90454009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257008795A Pending KR20250048368A (ko) | 2022-09-21 | 2022-09-21 | 프로브 카드용 프로브 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260050010A1 (https=) |
| JP (1) | JPWO2024062560A1 (https=) |
| KR (1) | KR20250048368A (https=) |
| CN (1) | CN119923567A (https=) |
| TW (1) | TWI866465B (https=) |
| WO (1) | WO2024062560A1 (https=) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3768305B2 (ja) * | 1996-10-22 | 2006-04-19 | 株式会社日本マイクロニクス | 平板状被検査体検査用プローブユニット |
| EP1610131A1 (en) * | 2004-06-21 | 2005-12-28 | Capres A/S | Flexible probe |
| JP2006284292A (ja) * | 2005-03-31 | 2006-10-19 | Kanai Hiroaki | コンタクトプローブ構造体 |
| JP4823617B2 (ja) * | 2005-09-09 | 2011-11-24 | 日本発條株式会社 | 導電性接触子および導電性接触子の製造方法 |
| US7384277B1 (en) * | 2006-12-17 | 2008-06-10 | Formfactor, Inc. | Reinforced contact elements |
| TWI369498B (en) * | 2008-06-18 | 2012-08-01 | Star Techn Inc | Probe and probe card for integrated circiut devices using the same |
| US9702904B2 (en) * | 2011-03-21 | 2017-07-11 | Formfactor, Inc. | Non-linear vertical leaf spring |
| JP2014013184A (ja) * | 2012-07-04 | 2014-01-23 | Micronics Japan Co Ltd | カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット |
| SG11201510255QA (en) * | 2013-07-11 | 2016-01-28 | Johnstech Int Corp | Testing apparatus for wafer level ic testing |
| WO2016156003A1 (en) * | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications |
| KR101962644B1 (ko) * | 2017-08-23 | 2019-03-28 | 리노공업주식회사 | 검사프로브 및 이를 사용한 검사장치 |
| IT202000030194A1 (it) * | 2020-12-09 | 2022-06-09 | Technoprobe Spa | Sonda di contatto per teste di misura di dispositivi elettronici e relativa testa di misura |
| WO2022196399A1 (ja) * | 2021-03-16 | 2022-09-22 | 日本電子材料株式会社 | プローブカード用プローブおよびその製造方法 |
| JP7847658B2 (ja) * | 2022-09-21 | 2026-04-17 | 日本電子材料株式会社 | プローブカード用プローブ |
-
2022
- 2022-09-21 US US19/102,033 patent/US20260050010A1/en active Pending
- 2022-09-21 JP JP2024547997A patent/JPWO2024062560A1/ja active Pending
- 2022-09-21 WO PCT/JP2022/035189 patent/WO2024062560A1/ja not_active Ceased
- 2022-09-21 KR KR1020257008795A patent/KR20250048368A/ko active Pending
- 2022-09-21 CN CN202280100280.6A patent/CN119923567A/zh active Pending
-
2023
- 2023-09-13 TW TW112134919A patent/TWI866465B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN119923567A (zh) | 2025-05-02 |
| JPWO2024062560A1 (https=) | 2024-03-28 |
| WO2024062560A1 (ja) | 2024-03-28 |
| TWI866465B (zh) | 2024-12-11 |
| US20260050010A1 (en) | 2026-02-19 |
| TW202429090A (zh) | 2024-07-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D13 | Search requested |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14 | Search report completed |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D14-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13 | Application amended |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |