CN119923567A - 探针卡用探针 - Google Patents

探针卡用探针 Download PDF

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Publication number
CN119923567A
CN119923567A CN202280100280.6A CN202280100280A CN119923567A CN 119923567 A CN119923567 A CN 119923567A CN 202280100280 A CN202280100280 A CN 202280100280A CN 119923567 A CN119923567 A CN 119923567A
Authority
CN
China
Prior art keywords
probe
probe card
stress dispersion
metal
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280100280.6A
Other languages
English (en)
Chinese (zh)
Inventor
武田朋之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Publication of CN119923567A publication Critical patent/CN119923567A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN202280100280.6A 2022-09-21 2022-09-21 探针卡用探针 Pending CN119923567A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/035189 WO2024062560A1 (ja) 2022-09-21 2022-09-21 プローブカード用プローブ

Publications (1)

Publication Number Publication Date
CN119923567A true CN119923567A (zh) 2025-05-02

Family

ID=90454009

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280100280.6A Pending CN119923567A (zh) 2022-09-21 2022-09-21 探针卡用探针

Country Status (6)

Country Link
US (1) US20260050010A1 (https=)
JP (1) JPWO2024062560A1 (https=)
KR (1) KR20250048368A (https=)
CN (1) CN119923567A (https=)
TW (1) TWI866465B (https=)
WO (1) WO2024062560A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3768305B2 (ja) * 1996-10-22 2006-04-19 株式会社日本マイクロニクス 平板状被検査体検査用プローブユニット
EP1610131A1 (en) * 2004-06-21 2005-12-28 Capres A/S Flexible probe
JP2006284292A (ja) * 2005-03-31 2006-10-19 Kanai Hiroaki コンタクトプローブ構造体
JP4823617B2 (ja) * 2005-09-09 2011-11-24 日本発條株式会社 導電性接触子および導電性接触子の製造方法
US7384277B1 (en) * 2006-12-17 2008-06-10 Formfactor, Inc. Reinforced contact elements
TWI369498B (en) * 2008-06-18 2012-08-01 Star Techn Inc Probe and probe card for integrated circiut devices using the same
US9702904B2 (en) * 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
JP2014013184A (ja) * 2012-07-04 2014-01-23 Micronics Japan Co Ltd カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット
SG11201510255QA (en) * 2013-07-11 2016-01-28 Johnstech Int Corp Testing apparatus for wafer level ic testing
WO2016156003A1 (en) * 2015-03-31 2016-10-06 Technoprobe S.P.A. Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications
KR101962644B1 (ko) * 2017-08-23 2019-03-28 리노공업주식회사 검사프로브 및 이를 사용한 검사장치
IT202000030194A1 (it) * 2020-12-09 2022-06-09 Technoprobe Spa Sonda di contatto per teste di misura di dispositivi elettronici e relativa testa di misura
WO2022196399A1 (ja) * 2021-03-16 2022-09-22 日本電子材料株式会社 プローブカード用プローブおよびその製造方法
JP7847658B2 (ja) * 2022-09-21 2026-04-17 日本電子材料株式会社 プローブカード用プローブ

Also Published As

Publication number Publication date
JPWO2024062560A1 (https=) 2024-03-28
WO2024062560A1 (ja) 2024-03-28
TWI866465B (zh) 2024-12-11
KR20250048368A (ko) 2025-04-08
US20260050010A1 (en) 2026-02-19
TW202429090A (zh) 2024-07-16

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