TWI866465B - 用於探針卡之探針 - Google Patents

用於探針卡之探針 Download PDF

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Publication number
TWI866465B
TWI866465B TW112134919A TW112134919A TWI866465B TW I866465 B TWI866465 B TW I866465B TW 112134919 A TW112134919 A TW 112134919A TW 112134919 A TW112134919 A TW 112134919A TW I866465 B TWI866465 B TW I866465B
Authority
TW
Taiwan
Prior art keywords
probe
metal layer
stress dispersion
card
metal
Prior art date
Application number
TW112134919A
Other languages
English (en)
Chinese (zh)
Other versions
TW202429090A (zh
Inventor
武田朋之
Original Assignee
日商日本電子材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本電子材料股份有限公司 filed Critical 日商日本電子材料股份有限公司
Publication of TW202429090A publication Critical patent/TW202429090A/zh
Application granted granted Critical
Publication of TWI866465B publication Critical patent/TWI866465B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW112134919A 2022-09-21 2023-09-13 用於探針卡之探針 TWI866465B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/035189 2022-09-21
PCT/JP2022/035189 WO2024062560A1 (ja) 2022-09-21 2022-09-21 プローブカード用プローブ

Publications (2)

Publication Number Publication Date
TW202429090A TW202429090A (zh) 2024-07-16
TWI866465B true TWI866465B (zh) 2024-12-11

Family

ID=90454009

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112134919A TWI866465B (zh) 2022-09-21 2023-09-13 用於探針卡之探針

Country Status (6)

Country Link
US (1) US20260050010A1 (https=)
JP (1) JPWO2024062560A1 (https=)
KR (1) KR20250048368A (https=)
CN (1) CN119923567A (https=)
TW (1) TWI866465B (https=)
WO (1) WO2024062560A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10123173A (ja) * 1996-10-22 1998-05-15 Micronics Japan Co Ltd 平板状被検査体検査用プローブユニット
JP2006284292A (ja) * 2005-03-31 2006-10-19 Kanai Hiroaki コンタクトプローブ構造体
CN1973208A (zh) * 2004-06-21 2007-05-30 卡普雷斯股份有限公司 一种用于提供探头对准的方法
CN101258409A (zh) * 2005-09-09 2008-09-03 日本发条株式会社 导电性触头以及导电性触头的制造方法
JP2010513870A (ja) * 2006-12-17 2010-04-30 フォームファクター， インコーポレイテッド 補強コンタクト部品
JP2014013184A (ja) * 2012-07-04 2014-01-23 Micronics Japan Co Ltd カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット
US20150015287A1 (en) * 2013-07-11 2015-01-15 Johnstech International Corporation Testing apparatus and method for microcircuit and wafer level ic testing
CN107430151A (zh) * 2015-03-31 2017-12-01 泰克诺探头公司 特别适用于高频应用的竖向接触探针和包含其的测试头
TW202223407A (zh) * 2020-12-09 2022-06-16 義大利商探針科技公司 用於電子裝置的探針頭的接觸探針及對應探針頭

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI369498B (en) * 2008-06-18 2012-08-01 Star Techn Inc Probe and probe card for integrated circiut devices using the same
US9702904B2 (en) * 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
KR101962644B1 (ko) * 2017-08-23 2019-03-28 리노공업주식회사 검사프로브 및 이를 사용한 검사장치
WO2022196399A1 (ja) * 2021-03-16 2022-09-22 日本電子材料株式会社 プローブカード用プローブおよびその製造方法
JP7847658B2 (ja) * 2022-09-21 2026-04-17 日本電子材料株式会社 プローブカード用プローブ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10123173A (ja) * 1996-10-22 1998-05-15 Micronics Japan Co Ltd 平板状被検査体検査用プローブユニット
CN1973208A (zh) * 2004-06-21 2007-05-30 卡普雷斯股份有限公司 一种用于提供探头对准的方法
JP2006284292A (ja) * 2005-03-31 2006-10-19 Kanai Hiroaki コンタクトプローブ構造体
CN101258409A (zh) * 2005-09-09 2008-09-03 日本发条株式会社 导电性触头以及导电性触头的制造方法
JP2010513870A (ja) * 2006-12-17 2010-04-30 フォームファクター， インコーポレイテッド 補強コンタクト部品
JP2014013184A (ja) * 2012-07-04 2014-01-23 Micronics Japan Co Ltd カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット
US20150015287A1 (en) * 2013-07-11 2015-01-15 Johnstech International Corporation Testing apparatus and method for microcircuit and wafer level ic testing
CN107430151A (zh) * 2015-03-31 2017-12-01 泰克诺探头公司 特别适用于高频应用的竖向接触探针和包含其的测试头
TW202223407A (zh) * 2020-12-09 2022-06-16 義大利商探針科技公司 用於電子裝置的探針頭的接觸探針及對應探針頭

Also Published As

Publication number Publication date
CN119923567A (zh) 2025-05-02
JPWO2024062560A1 (https=) 2024-03-28
WO2024062560A1 (ja) 2024-03-28
KR20250048368A (ko) 2025-04-08
US20260050010A1 (en) 2026-02-19
TW202429090A (zh) 2024-07-16

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