JPWO2024010021A5 - - Google Patents
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- Publication number
- JPWO2024010021A5 JPWO2024010021A5 JP2024532601A JP2024532601A JPWO2024010021A5 JP WO2024010021 A5 JPWO2024010021 A5 JP WO2024010021A5 JP 2024532601 A JP2024532601 A JP 2024532601A JP 2024532601 A JP2024532601 A JP 2024532601A JP WO2024010021 A5 JPWO2024010021 A5 JP WO2024010021A5
- Authority
- JP
- Japan
- Prior art keywords
- recess
- substrate according
- volume
- film layer
- sum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 7
- 239000004020 conductor Substances 0.000 claims 4
- 230000007423 decrease Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022108630 | 2022-07-05 | ||
| PCT/JP2023/024867 WO2024010021A1 (ja) | 2022-07-05 | 2023-07-05 | 基板、電子装置、電子モジュールおよびモジュール装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024010021A1 JPWO2024010021A1 (https=) | 2024-01-11 |
| JPWO2024010021A5 true JPWO2024010021A5 (https=) | 2025-03-18 |
Family
ID=89453412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024532601A Pending JPWO2024010021A1 (https=) | 2022-07-05 | 2023-07-05 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250385482A1 (https=) |
| JP (1) | JPWO2024010021A1 (https=) |
| CN (1) | CN119487978A (https=) |
| DE (1) | DE112023002934T5 (https=) |
| WO (1) | WO2024010021A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736468U (ja) * | 1993-12-06 | 1995-07-04 | 株式会社東海理化電機製作所 | 電子部品の放熱構造 |
| JP3874888B2 (ja) * | 1997-05-30 | 2007-01-31 | 新潟精密株式会社 | メモリモジュールおよびメモリシステム |
| JP2001044219A (ja) * | 1999-07-30 | 2001-02-16 | Toshiba Corp | 半導体装置 |
| US7405102B2 (en) * | 2006-06-09 | 2008-07-29 | Freescale Semiconductor, Inc. | Methods and apparatus for thermal management in a multi-layer embedded chip structure |
| JP7384121B2 (ja) * | 2020-07-09 | 2023-11-21 | Tdk株式会社 | 回路基板及びこれを用いた回路モジュール |
-
2023
- 2023-07-05 WO PCT/JP2023/024867 patent/WO2024010021A1/ja not_active Ceased
- 2023-07-05 JP JP2024532601A patent/JPWO2024010021A1/ja active Pending
- 2023-07-05 US US18/878,159 patent/US20250385482A1/en active Pending
- 2023-07-05 DE DE112023002934.2T patent/DE112023002934T5/de active Pending
- 2023-07-05 CN CN202380049765.1A patent/CN119487978A/zh active Pending
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