JPWO2024004399A1 - - Google Patents
Info
- Publication number
- JPWO2024004399A1 JPWO2024004399A1 JP2024530352A JP2024530352A JPWO2024004399A1 JP WO2024004399 A1 JPWO2024004399 A1 JP WO2024004399A1 JP 2024530352 A JP2024530352 A JP 2024530352A JP 2024530352 A JP2024530352 A JP 2024530352A JP WO2024004399 A1 JPWO2024004399 A1 JP WO2024004399A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32146—Amplitude modulation, includes pulsing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
- H02J7/90—Regulation of charging or discharging current or voltage
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263356713P | 2022-06-29 | 2022-06-29 | |
| PCT/JP2023/017793 WO2024004399A1 (ja) | 2022-06-29 | 2023-05-11 | プラズマ処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024004399A1 true JPWO2024004399A1 (https=) | 2024-01-04 |
Family
ID=89381866
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530285A Pending JPWO2024004256A1 (https=) | 2022-06-29 | 2023-02-15 | |
| JP2024530353A Pending JPWO2024004400A1 (https=) | 2022-06-29 | 2023-05-11 | |
| JP2024530352A Pending JPWO2024004399A1 (https=) | 2022-06-29 | 2023-05-11 | |
| JP2024530374A Pending JPWO2024004444A1 (https=) | 2022-06-29 | 2023-05-23 | |
| JP2024530403A Pending JPWO2024004497A1 (https=) | 2022-06-29 | 2023-05-31 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530285A Pending JPWO2024004256A1 (https=) | 2022-06-29 | 2023-02-15 | |
| JP2024530353A Pending JPWO2024004400A1 (https=) | 2022-06-29 | 2023-05-11 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530374A Pending JPWO2024004444A1 (https=) | 2022-06-29 | 2023-05-23 | |
| JP2024530403A Pending JPWO2024004497A1 (https=) | 2022-06-29 | 2023-05-31 |
Country Status (6)
| Country | Link |
|---|---|
| US (5) | US20250132130A1 (https=) |
| JP (5) | JPWO2024004256A1 (https=) |
| KR (5) | KR20250028375A (https=) |
| CN (5) | CN119404597A (https=) |
| TW (5) | TW202408318A (https=) |
| WO (5) | WO2024004256A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250299937A1 (en) * | 2024-03-25 | 2025-09-25 | Applied Materials, Inc. | Cryogenic moisture trap for improved etch and particle reduction |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4286404B2 (ja) * | 1999-10-15 | 2009-07-01 | 東京エレクトロン株式会社 | 整合器およびプラズマ処理装置 |
| WO2013088640A1 (ja) * | 2011-12-14 | 2013-06-20 | パナソニック株式会社 | 非接触コネクタ装置及びシステム |
| JP6257071B2 (ja) * | 2012-09-12 | 2018-01-10 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
| JP2014176155A (ja) * | 2013-03-07 | 2014-09-22 | Hitachi Maxell Ltd | 非接触電力伝送装置及び非接触電力伝送方法 |
| JP6218650B2 (ja) | 2014-03-11 | 2017-10-25 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| WO2016129638A1 (ja) * | 2015-02-10 | 2016-08-18 | 株式会社ＥｘＨ | 電力供給システム |
| JP2017054646A (ja) * | 2015-09-08 | 2017-03-16 | 株式会社ダイヘン | 高周波電源装置、当該高周波電源装置を備えているプラズマ処理システムおよび非接触給電システム |
| WO2019182260A1 (ko) * | 2018-03-23 | 2019-09-26 | 홍잉 | 인라인 박막 프로세싱 장치 |
| JP7224165B2 (ja) * | 2018-12-14 | 2023-02-17 | キヤノントッキ株式会社 | アライメント装置、蒸着装置、および、電子デバイスの製造装置 |
| WO2021211269A1 (en) * | 2020-04-14 | 2021-10-21 | Lam Research Corporation | Transformer isolator having rf shield structure for effective magnetic power transfer |
| KR102378573B1 (ko) * | 2020-06-12 | 2022-03-23 | 한양대학교 산학협력단 | 플라즈마 생성기 |
| WO2023008448A1 (ja) * | 2021-07-30 | 2023-02-02 | 東京エレクトロン株式会社 | プラズマ処理システム及びプラズマ処理方法 |
| JPWO2024070848A1 (https=) * | 2022-09-30 | 2024-04-04 | ||
| WO2025126436A1 (ja) * | 2023-12-14 | 2025-06-19 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| WO2025126437A1 (ja) * | 2023-12-14 | 2025-06-19 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2023
- 2023-02-15 JP JP2024530285A patent/JPWO2024004256A1/ja active Pending
- 2023-02-15 CN CN202380048424.2A patent/CN119404597A/zh active Pending
- 2023-02-15 KR KR1020257001713A patent/KR20250028375A/ko active Pending
- 2023-02-15 WO PCT/JP2023/005254 patent/WO2024004256A1/ja not_active Ceased
- 2023-05-11 JP JP2024530353A patent/JPWO2024004400A1/ja active Pending
- 2023-05-11 KR KR1020257001731A patent/KR20250029135A/ko active Pending
- 2023-05-11 CN CN202380048491.4A patent/CN119404598A/zh active Pending
- 2023-05-11 WO PCT/JP2023/017795 patent/WO2024004400A1/ja not_active Ceased
- 2023-05-11 WO PCT/JP2023/017793 patent/WO2024004399A1/ja not_active Ceased
- 2023-05-11 JP JP2024530352A patent/JPWO2024004399A1/ja active Pending
- 2023-05-11 KR KR1020257001799A patent/KR20250029138A/ko active Pending
- 2023-05-11 CN CN202380048494.8A patent/CN119404599A/zh active Pending
- 2023-05-23 JP JP2024530374A patent/JPWO2024004444A1/ja active Pending
- 2023-05-23 WO PCT/JP2023/019150 patent/WO2024004444A1/ja not_active Ceased
- 2023-05-23 CN CN202380048421.9A patent/CN119404596A/zh active Pending
- 2023-05-23 KR KR1020257001716A patent/KR20250029884A/ko active Pending
- 2023-05-31 JP JP2024530403A patent/JPWO2024004497A1/ja active Pending
- 2023-05-31 KR KR1020257001714A patent/KR20250033227A/ko active Pending
- 2023-05-31 CN CN202380048423.8A patent/CN119452735A/zh active Pending
- 2023-05-31 WO PCT/JP2023/020311 patent/WO2024004497A1/ja not_active Ceased
- 2023-06-19 TW TW112122914A patent/TW202408318A/zh unknown
- 2023-06-19 TW TW112122928A patent/TW202408320A/zh unknown
- 2023-06-19 TW TW112122927A patent/TW202408319A/zh unknown
- 2023-06-19 TW TW112122966A patent/TW202416340A/zh unknown
- 2023-06-19 TW TW112122924A patent/TW202420378A/zh unknown
-
2024
- 2024-12-24 US US19/000,712 patent/US20250132130A1/en active Pending
- 2024-12-27 US US19/002,994 patent/US20250149307A1/en active Pending
- 2024-12-27 US US19/003,836 patent/US20250149298A1/en active Pending
- 2024-12-27 US US19/003,142 patent/US20250149297A1/en active Pending
- 2024-12-27 US US19/003,264 patent/US20250149308A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN119404599A (zh) | 2025-02-07 |
| US20250149307A1 (en) | 2025-05-08 |
| US20250132130A1 (en) | 2025-04-24 |
| US20250149308A1 (en) | 2025-05-08 |
| KR20250029138A (ko) | 2025-03-04 |
| TW202408319A (zh) | 2024-02-16 |
| WO2024004400A1 (ja) | 2024-01-04 |
| KR20250029884A (ko) | 2025-03-05 |
| CN119404597A (zh) | 2025-02-07 |
| US20250149297A1 (en) | 2025-05-08 |
| JPWO2024004497A1 (https=) | 2024-01-04 |
| CN119404596A (zh) | 2025-02-07 |
| CN119452735A (zh) | 2025-02-14 |
| TW202416340A (zh) | 2024-04-16 |
| JPWO2024004256A1 (https=) | 2024-01-04 |
| TW202408320A (zh) | 2024-02-16 |
| TW202420378A (zh) | 2024-05-16 |
| JPWO2024004400A1 (https=) | 2024-01-04 |
| JPWO2024004444A1 (https=) | 2024-01-04 |
| CN119404598A (zh) | 2025-02-07 |
| WO2024004444A1 (ja) | 2024-01-04 |
| WO2024004399A1 (ja) | 2024-01-04 |
| WO2024004497A1 (ja) | 2024-01-04 |
| KR20250033227A (ko) | 2025-03-07 |
| KR20250029135A (ko) | 2025-03-04 |
| US20250149298A1 (en) | 2025-05-08 |
| KR20250028375A (ko) | 2025-02-28 |
| TW202408318A (zh) | 2024-02-16 |
| WO2024004256A1 (ja) | 2024-01-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260212 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20260212 |