JPWO2023282040A5 - - Google Patents

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Publication number
JPWO2023282040A5
JPWO2023282040A5 JP2023533510A JP2023533510A JPWO2023282040A5 JP WO2023282040 A5 JPWO2023282040 A5 JP WO2023282040A5 JP 2023533510 A JP2023533510 A JP 2023533510A JP 2023533510 A JP2023533510 A JP 2023533510A JP WO2023282040 A5 JPWO2023282040 A5 JP WO2023282040A5
Authority
JP
Japan
Prior art keywords
coil
semiconductor device
thickness direction
semiconductor
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533510A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023282040A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/024518 external-priority patent/WO2023282040A1/ja
Publication of JPWO2023282040A1 publication Critical patent/JPWO2023282040A1/ja
Publication of JPWO2023282040A5 publication Critical patent/JPWO2023282040A5/ja
Pending legal-status Critical Current

Links

JP2023533510A 2021-07-06 2022-06-20 Pending JPWO2023282040A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021112293 2021-07-06
PCT/JP2022/024518 WO2023282040A1 (ja) 2021-07-06 2022-06-20 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023282040A1 JPWO2023282040A1 (https=) 2023-01-12
JPWO2023282040A5 true JPWO2023282040A5 (https=) 2025-06-20

Family

ID=84801503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533510A Pending JPWO2023282040A1 (https=) 2021-07-06 2022-06-20

Country Status (5)

Country Link
US (1) US20240234402A9 (https=)
JP (1) JPWO2023282040A1 (https=)
CN (1) CN117616563A (https=)
DE (1) DE112022003413T5 (https=)
WO (1) WO2023282040A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791900B2 (en) * 2006-08-28 2010-09-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
JP5303167B2 (ja) * 2008-03-25 2013-10-02 ローム株式会社 スイッチ制御装置及びこれを用いたモータ駆動装置
US8674486B2 (en) * 2011-12-14 2014-03-18 Samsung Electro-Mechanics Isolation barrier device and methods of use
WO2014171125A1 (ja) * 2013-04-15 2014-10-23 パナソニック株式会社 電磁共鳴結合器及び高周波伝送装置
JP6591637B2 (ja) * 2013-11-13 2019-10-16 ローム株式会社 半導体装置および半導体モジュール
JP6062486B2 (ja) * 2015-05-13 2017-01-18 ルネサスエレクトロニクス株式会社 半導体装置
CN112652615B (zh) * 2020-12-18 2025-02-28 合肥乘翎微电子有限公司 基于晶圆级封装的隔离电源芯片及其制备方法

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