JPWO2023281906A5 - - Google Patents
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- Publication number
- JPWO2023281906A5 JPWO2023281906A5 JP2023533448A JP2023533448A JPWO2023281906A5 JP WO2023281906 A5 JPWO2023281906 A5 JP WO2023281906A5 JP 2023533448 A JP2023533448 A JP 2023533448A JP 2023533448 A JP2023533448 A JP 2023533448A JP WO2023281906 A5 JPWO2023281906 A5 JP WO2023281906A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- thermosetting adhesive
- sheet according
- epoxy resin
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 13
- 230000001070 adhesive effect Effects 0.000 claims 13
- 239000003822 epoxy resin Substances 0.000 claims 13
- 229920000647 polyepoxide Polymers 0.000 claims 13
- 229920001187 thermosetting polymer Polymers 0.000 claims 13
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 6
- 239000004593 Epoxy Substances 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000000945 filler Substances 0.000 claims 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 2
- 239000004202 carbamide Substances 0.000 claims 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 2
- 239000000539 dimer Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021113987 | 2021-07-09 | ||
| PCT/JP2022/019362 WO2023281906A1 (ja) | 2021-07-09 | 2022-04-28 | 熱硬化性接着シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023281906A1 JPWO2023281906A1 (https=) | 2023-01-12 |
| JPWO2023281906A5 true JPWO2023281906A5 (https=) | 2025-02-13 |
Family
ID=84800214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023533448A Pending JPWO2023281906A1 (https=) | 2021-07-09 | 2022-04-28 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023281906A1 (https=) |
| CN (1) | CN117616093A (https=) |
| TW (1) | TW202313752A (https=) |
| WO (1) | WO2023281906A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4258984B2 (ja) * | 2001-03-15 | 2009-04-30 | 日立化成工業株式会社 | 半導体装置の製造方法 |
| JP4776188B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | 半導体装置製造方法およびウエハ加工用テープ |
| KR100938745B1 (ko) * | 2007-11-28 | 2010-01-26 | 제일모직주식회사 | 고비점 용매 및 저비점 용매를 포함하는 반도체 다이접착제 조성물 및 이에 의한 접착필름 |
| KR101604323B1 (ko) * | 2012-07-26 | 2016-03-17 | 후루카와 덴키 고교 가부시키가이샤 | 반도체 웨이퍼 가공용 테이프의 제조 방법 및 반도체 웨이퍼 가공용 테이프 |
| JP6289311B2 (ja) * | 2014-08-29 | 2018-03-07 | 積水化成品工業株式会社 | 粘接着剤組成物、粘接着シート、被着体の接着方法及び複合材 |
| WO2018047919A1 (ja) * | 2016-09-07 | 2018-03-15 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
-
2022
- 2022-04-28 WO PCT/JP2022/019362 patent/WO2023281906A1/ja not_active Ceased
- 2022-04-28 CN CN202280048449.8A patent/CN117616093A/zh active Pending
- 2022-04-28 JP JP2023533448A patent/JPWO2023281906A1/ja active Pending
- 2022-06-30 TW TW111124470A patent/TW202313752A/zh unknown
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