JPWO2023281906A1 - - Google Patents
Info
- Publication number
- JPWO2023281906A1 JPWO2023281906A1 JP2023533448A JP2023533448A JPWO2023281906A1 JP WO2023281906 A1 JPWO2023281906 A1 JP WO2023281906A1 JP 2023533448 A JP2023533448 A JP 2023533448A JP 2023533448 A JP2023533448 A JP 2023533448A JP WO2023281906 A1 JPWO2023281906 A1 JP WO2023281906A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021113987 | 2021-07-09 | ||
| PCT/JP2022/019362 WO2023281906A1 (ja) | 2021-07-09 | 2022-04-28 | 熱硬化性接着シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023281906A1 true JPWO2023281906A1 (https=) | 2023-01-12 |
| JPWO2023281906A5 JPWO2023281906A5 (https=) | 2025-02-13 |
Family
ID=84800214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023533448A Pending JPWO2023281906A1 (https=) | 2021-07-09 | 2022-04-28 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023281906A1 (https=) |
| CN (1) | CN117616093A (https=) |
| TW (1) | TW202313752A (https=) |
| WO (1) | WO2023281906A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006049482A (ja) * | 2004-08-03 | 2006-02-16 | Furukawa Electric Co Ltd:The | 半導体装置製造方法およびウエハ加工用テープ |
| US20090136748A1 (en) * | 2007-11-28 | 2009-05-28 | Han Nim Choi | Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods |
| WO2018047919A1 (ja) * | 2016-09-07 | 2018-03-15 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4258984B2 (ja) * | 2001-03-15 | 2009-04-30 | 日立化成工業株式会社 | 半導体装置の製造方法 |
| KR101604323B1 (ko) * | 2012-07-26 | 2016-03-17 | 후루카와 덴키 고교 가부시키가이샤 | 반도체 웨이퍼 가공용 테이프의 제조 방법 및 반도체 웨이퍼 가공용 테이프 |
| JP6289311B2 (ja) * | 2014-08-29 | 2018-03-07 | 積水化成品工業株式会社 | 粘接着剤組成物、粘接着シート、被着体の接着方法及び複合材 |
-
2022
- 2022-04-28 WO PCT/JP2022/019362 patent/WO2023281906A1/ja not_active Ceased
- 2022-04-28 CN CN202280048449.8A patent/CN117616093A/zh active Pending
- 2022-04-28 JP JP2023533448A patent/JPWO2023281906A1/ja active Pending
- 2022-06-30 TW TW111124470A patent/TW202313752A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006049482A (ja) * | 2004-08-03 | 2006-02-16 | Furukawa Electric Co Ltd:The | 半導体装置製造方法およびウエハ加工用テープ |
| US20090136748A1 (en) * | 2007-11-28 | 2009-05-28 | Han Nim Choi | Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods |
| WO2018047919A1 (ja) * | 2016-09-07 | 2018-03-15 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023281906A1 (ja) | 2023-01-12 |
| TW202313752A (zh) | 2023-04-01 |
| CN117616093A (zh) | 2024-02-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250204 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250204 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260414 |