JPWO2023248860A5 - - Google Patents

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Publication number
JPWO2023248860A5
JPWO2023248860A5 JP2024528869A JP2024528869A JPWO2023248860A5 JP WO2023248860 A5 JPWO2023248860 A5 JP WO2023248860A5 JP 2024528869 A JP2024528869 A JP 2024528869A JP 2024528869 A JP2024528869 A JP 2024528869A JP WO2023248860 A5 JPWO2023248860 A5 JP WO2023248860A5
Authority
JP
Japan
Prior art keywords
flow
valve
controls
supply line
etching liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528869A
Other languages
English (en)
Japanese (ja)
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JPWO2023248860A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/021837 external-priority patent/WO2023248860A1/ja
Publication of JPWO2023248860A1 publication Critical patent/JPWO2023248860A1/ja
Publication of JPWO2023248860A5 publication Critical patent/JPWO2023248860A5/ja
Pending legal-status Critical Current

Links

JP2024528869A 2022-06-24 2023-06-13 Pending JPWO2023248860A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022101701 2022-06-24
PCT/JP2023/021837 WO2023248860A1 (ja) 2022-06-24 2023-06-13 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JPWO2023248860A1 JPWO2023248860A1 (https=) 2023-12-28
JPWO2023248860A5 true JPWO2023248860A5 (https=) 2025-02-28

Family

ID=89379764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528869A Pending JPWO2023248860A1 (https=) 2022-06-24 2023-06-13

Country Status (3)

Country Link
JP (1) JPWO2023248860A1 (https=)
TW (1) TW202419208A (https=)
WO (1) WO2023248860A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1295320A2 (en) * 2000-06-30 2003-03-26 MEMC Electronic Materials, Inc. Process for etching silicon wafers
JP4656923B2 (ja) * 2004-12-01 2011-03-23 シャープ株式会社 シリコン結晶基板の製造方法と製造装置
KR20080022917A (ko) * 2006-09-08 2008-03-12 삼성전자주식회사 식각액 공급장치, 식각장치 및 식각방법
JP4995237B2 (ja) * 2009-06-22 2012-08-08 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2013065614A (ja) * 2011-09-15 2013-04-11 Pre-Tech At:Kk シリコンウェーハのウェットエッチング方法及びウェットエッチング装置
JP2018147908A (ja) * 2015-07-27 2018-09-20 東京エレクトロン株式会社 基板処理方法および基板処理装置

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