JPWO2023248860A1 - - Google Patents

Info

Publication number
JPWO2023248860A1
JPWO2023248860A1 JP2024528869A JP2024528869A JPWO2023248860A1 JP WO2023248860 A1 JPWO2023248860 A1 JP WO2023248860A1 JP 2024528869 A JP2024528869 A JP 2024528869A JP 2024528869 A JP2024528869 A JP 2024528869A JP WO2023248860 A1 JPWO2023248860 A1 JP WO2023248860A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528869A
Other languages
Japanese (ja)
Other versions
JPWO2023248860A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023248860A1 publication Critical patent/JPWO2023248860A1/ja
Publication of JPWO2023248860A5 publication Critical patent/JPWO2023248860A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2024528869A 2022-06-24 2023-06-13 Pending JPWO2023248860A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022101701 2022-06-24
PCT/JP2023/021837 WO2023248860A1 (ja) 2022-06-24 2023-06-13 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JPWO2023248860A1 true JPWO2023248860A1 (https=) 2023-12-28
JPWO2023248860A5 JPWO2023248860A5 (https=) 2025-02-28

Family

ID=89379764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528869A Pending JPWO2023248860A1 (https=) 2022-06-24 2023-06-13

Country Status (3)

Country Link
JP (1) JPWO2023248860A1 (https=)
TW (1) TW202419208A (https=)
WO (1) WO2023248860A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004503081A (ja) * 2000-06-30 2004-01-29 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド シリコンウェーハのエッチング方法
JP2006151779A (ja) * 2004-12-01 2006-06-15 Sharp Corp シリコン結晶基板の製造方法と製造装置
JP2008066706A (ja) * 2006-09-08 2008-03-21 Samsung Electronics Co Ltd エッチング液供給装置、エッチング装置及びエッチング方法
JP2009218617A (ja) * 2009-06-22 2009-09-24 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2013065614A (ja) * 2011-09-15 2013-04-11 Pre-Tech At:Kk シリコンウェーハのウェットエッチング方法及びウェットエッチング装置
JP2018147908A (ja) * 2015-07-27 2018-09-20 東京エレクトロン株式会社 基板処理方法および基板処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004503081A (ja) * 2000-06-30 2004-01-29 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド シリコンウェーハのエッチング方法
JP2006151779A (ja) * 2004-12-01 2006-06-15 Sharp Corp シリコン結晶基板の製造方法と製造装置
JP2008066706A (ja) * 2006-09-08 2008-03-21 Samsung Electronics Co Ltd エッチング液供給装置、エッチング装置及びエッチング方法
JP2009218617A (ja) * 2009-06-22 2009-09-24 Tokyo Electron Ltd 基板処理装置および基板処理方法
JP2013065614A (ja) * 2011-09-15 2013-04-11 Pre-Tech At:Kk シリコンウェーハのウェットエッチング方法及びウェットエッチング装置
JP2018147908A (ja) * 2015-07-27 2018-09-20 東京エレクトロン株式会社 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
WO2023248860A1 (ja) 2023-12-28
TW202419208A (zh) 2024-05-16

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