JPWO2023233878A5 - - Google Patents

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Publication number
JPWO2023233878A5
JPWO2023233878A5 JP2024524245A JP2024524245A JPWO2023233878A5 JP WO2023233878 A5 JPWO2023233878 A5 JP WO2023233878A5 JP 2024524245 A JP2024524245 A JP 2024524245A JP 2024524245 A JP2024524245 A JP 2024524245A JP WO2023233878 A5 JPWO2023233878 A5 JP WO2023233878A5
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JP
Japan
Prior art keywords
layer
composition
film
film according
contained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024524245A
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English (en)
Japanese (ja)
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JPWO2023233878A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/016331 external-priority patent/WO2023233878A1/ja
Publication of JPWO2023233878A1 publication Critical patent/JPWO2023233878A1/ja
Publication of JPWO2023233878A5 publication Critical patent/JPWO2023233878A5/ja
Pending legal-status Critical Current

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JP2024524245A 2022-05-31 2023-04-25 Pending JPWO2023233878A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022089034 2022-05-31
PCT/JP2023/016331 WO2023233878A1 (ja) 2022-05-31 2023-04-25 フィルム及び積層体

Publications (2)

Publication Number Publication Date
JPWO2023233878A1 JPWO2023233878A1 (https=) 2023-12-07
JPWO2023233878A5 true JPWO2023233878A5 (https=) 2025-02-07

Family

ID=89026283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024524245A Pending JPWO2023233878A1 (https=) 2022-05-31 2023-04-25

Country Status (3)

Country Link
US (1) US12570076B2 (https=)
JP (1) JPWO2023233878A1 (https=)
WO (1) WO2023233878A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023233877A1 (https=) * 2022-05-30 2023-12-07
JPWO2023233878A1 (https=) * 2022-05-31 2023-12-07

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992005954A1 (en) * 1990-09-28 1992-04-16 Daicel Chemical Industries, Ltd. Composite film
JP2003062942A (ja) * 2001-08-28 2003-03-05 Kyocera Corp 絶縁フィルムおよびこれを用いた多層配線基板
JP4017932B2 (ja) * 2002-07-22 2007-12-05 ポリマテック株式会社 熱伝導性高分子成形体の製造方法
CN101795859A (zh) * 2007-11-13 2010-08-04 三星精密化学株式会社 具有均匀介电常数的预浸料、以及使用该预浸料的覆金属层压板和印制线路板
CN103502006B (zh) 2011-03-30 2016-02-10 宇部兴产株式会社 聚酰亚胺膜和使用其的金属层压体
JP6133782B2 (ja) * 2011-10-31 2017-05-24 株式会社クラレ 熱可塑性液晶ポリマーフィルムならびにこれを用いた積層体および回路基板
WO2016117243A1 (ja) * 2015-01-21 2016-07-28 味の素株式会社 樹脂シートの製造方法
JP6561153B2 (ja) 2017-02-20 2019-08-14 株式会社有沢製作所 樹脂組成物、接着フィルム、カバーレイフィルム、積層板、樹脂付き銅箔及び樹脂付き銅張り積層板
DE112018005711T5 (de) * 2017-10-31 2020-07-16 AGC Inc. Formprodukt, metallkaschiertes Laminat, Leiterplatte und Verfahren zu deren Herstellung
JP7824567B2 (ja) * 2021-06-15 2026-03-05 Dic株式会社 積層体およびその製造方法
JPWO2023233878A1 (https=) * 2022-05-31 2023-12-07

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