JPWO2023228941A5 - - Google Patents
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- Publication number
- JPWO2023228941A5 JPWO2023228941A5 JP2024523306A JP2024523306A JPWO2023228941A5 JP WO2023228941 A5 JPWO2023228941 A5 JP WO2023228941A5 JP 2024523306 A JP2024523306 A JP 2024523306A JP 2024523306 A JP2024523306 A JP 2024523306A JP WO2023228941 A5 JPWO2023228941 A5 JP WO2023228941A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic component
- component module
- coupling electrode
- hot melt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022084601 | 2022-05-24 | ||
| JP2022084601 | 2022-05-24 | ||
| JP2022118120 | 2022-07-25 | ||
| JP2022118120 | 2022-07-25 | ||
| PCT/JP2023/019147 WO2023228941A1 (ja) | 2022-05-24 | 2023-05-23 | 電子部品モジュールおよびそれを備える無線通信デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023228941A1 JPWO2023228941A1 (https=) | 2023-11-30 |
| JPWO2023228941A5 true JPWO2023228941A5 (https=) | 2025-01-10 |
| JP7800676B2 JP7800676B2 (ja) | 2026-01-16 |
Family
ID=88919377
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523307A Pending JPWO2023228942A1 (https=) | 2022-05-24 | 2023-05-23 | |
| JP2024523306A Active JP7800676B2 (ja) | 2022-05-24 | 2023-05-23 | 電子部品モジュールおよびそれを備える無線通信デバイス |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523307A Pending JPWO2023228942A1 (https=) | 2022-05-24 | 2023-05-23 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250055176A1 (https=) |
| JP (2) | JPWO2023228942A1 (https=) |
| CN (1) | CN223503080U (https=) |
| WO (2) | WO2023228941A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5196389B2 (ja) * | 2006-03-23 | 2013-05-15 | 大阪シーリング印刷株式会社 | Ｒｆｉｄラベル及びｒｆｉｄラベルの製造方法 |
| JP2008107947A (ja) * | 2006-10-24 | 2008-05-08 | Toppan Printing Co Ltd | Ｒｆｉｄタグ |
| JP6046329B2 (ja) * | 2010-01-08 | 2016-12-14 | 早川ゴム株式会社 | レーザー光を用いた接合方法 |
| JP5939830B2 (ja) * | 2012-02-21 | 2016-06-22 | サトーホールディングス株式会社 | Ｒｆｉｄタグ |
| DE212019000393U1 (de) | 2018-10-15 | 2021-05-21 | Murata Manufacturing Co., Ltd. | Drahtlose Kommunikationsvorrichtung |
| DE112019006728T5 (de) * | 2019-01-25 | 2021-10-28 | Murata Manufacturing Co., Ltd. | Drahtloskommunikationsvorrichtung und verfahren zum herstellen derselben |
| JP7081729B2 (ja) | 2020-04-14 | 2022-06-07 | 株式会社村田製作所 | 無線通信デバイス製造システム |
| DE212022000091U1 (de) | 2021-07-02 | 2023-06-19 | Murata Manufacturing Co., Ltd. | Drahtloskommunikationsbauelement-Herstellungssystem |
-
2023
- 2023-05-23 JP JP2024523307A patent/JPWO2023228942A1/ja active Pending
- 2023-05-23 WO PCT/JP2023/019147 patent/WO2023228941A1/ja not_active Ceased
- 2023-05-23 WO PCT/JP2023/019152 patent/WO2023228942A1/ja not_active Ceased
- 2023-05-23 CN CN202390000333.7U patent/CN223503080U/zh active Active
- 2023-05-23 JP JP2024523306A patent/JP7800676B2/ja active Active
-
2024
- 2024-10-29 US US18/930,062 patent/US20250055176A1/en active Pending
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