JPWO2023228942A1 - - Google Patents
Info
- Publication number
- JPWO2023228942A1 JPWO2023228942A1 JP2024523307A JP2024523307A JPWO2023228942A1 JP WO2023228942 A1 JPWO2023228942 A1 JP WO2023228942A1 JP 2024523307 A JP2024523307 A JP 2024523307A JP 2024523307 A JP2024523307 A JP 2024523307A JP WO2023228942 A1 JPWO2023228942 A1 JP WO2023228942A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/06—Details
- H01Q9/065—Microstrip dipole antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
- H01Q9/285—Planar dipole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022084601 | 2022-05-24 | ||
| JP2022118120 | 2022-07-25 | ||
| PCT/JP2023/019152 WO2023228942A1 (ja) | 2022-05-24 | 2023-05-23 | 電子部品モジュールおよびそれを備える無線通信デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023228942A1 true JPWO2023228942A1 (https=) | 2023-11-30 |
| JPWO2023228942A5 JPWO2023228942A5 (https=) | 2025-01-30 |
Family
ID=88919377
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523307A Pending JPWO2023228942A1 (https=) | 2022-05-24 | 2023-05-23 | |
| JP2024523306A Active JP7800676B2 (ja) | 2022-05-24 | 2023-05-23 | 電子部品モジュールおよびそれを備える無線通信デバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024523306A Active JP7800676B2 (ja) | 2022-05-24 | 2023-05-23 | 電子部品モジュールおよびそれを備える無線通信デバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250055176A1 (https=) |
| JP (2) | JPWO2023228942A1 (https=) |
| CN (1) | CN223503080U (https=) |
| WO (2) | WO2023228941A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007256566A (ja) * | 2006-03-23 | 2007-10-04 | Osaka Sealing Printing Co Ltd | Rfidラベル及びrfidラベルの製造方法 |
| JP2013171428A (ja) * | 2012-02-21 | 2013-09-02 | Sato Holdings Corp | Rfidタグ |
| WO2020152915A1 (ja) * | 2019-01-25 | 2020-07-30 | 株式会社村田製作所 | 無線通信デバイスおよびその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008107947A (ja) * | 2006-10-24 | 2008-05-08 | Toppan Printing Co Ltd | Rfidタグ |
| JP6046329B2 (ja) * | 2010-01-08 | 2016-12-14 | 早川ゴム株式会社 | レーザー光を用いた接合方法 |
| DE212019000393U1 (de) | 2018-10-15 | 2021-05-21 | Murata Manufacturing Co., Ltd. | Drahtlose Kommunikationsvorrichtung |
| JP7081729B2 (ja) | 2020-04-14 | 2022-06-07 | 株式会社村田製作所 | 無線通信デバイス製造システム |
| DE212022000091U1 (de) | 2021-07-02 | 2023-06-19 | Murata Manufacturing Co., Ltd. | Drahtloskommunikationsbauelement-Herstellungssystem |
-
2023
- 2023-05-23 JP JP2024523307A patent/JPWO2023228942A1/ja active Pending
- 2023-05-23 WO PCT/JP2023/019147 patent/WO2023228941A1/ja not_active Ceased
- 2023-05-23 WO PCT/JP2023/019152 patent/WO2023228942A1/ja not_active Ceased
- 2023-05-23 CN CN202390000333.7U patent/CN223503080U/zh active Active
- 2023-05-23 JP JP2024523306A patent/JP7800676B2/ja active Active
-
2024
- 2024-10-29 US US18/930,062 patent/US20250055176A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007256566A (ja) * | 2006-03-23 | 2007-10-04 | Osaka Sealing Printing Co Ltd | Rfidラベル及びrfidラベルの製造方法 |
| JP2013171428A (ja) * | 2012-02-21 | 2013-09-02 | Sato Holdings Corp | Rfidタグ |
| WO2020152915A1 (ja) * | 2019-01-25 | 2020-07-30 | 株式会社村田製作所 | 無線通信デバイスおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN223503080U (zh) | 2025-10-31 |
| JP7800676B2 (ja) | 2026-01-16 |
| US20250055176A1 (en) | 2025-02-13 |
| JPWO2023228941A1 (https=) | 2023-11-30 |
| WO2023228942A1 (ja) | 2023-11-30 |
| WO2023228941A1 (ja) | 2023-11-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241113 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241113 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260106 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260304 |