JPWO2023228941A1 - - Google Patents

Info

Publication number
JPWO2023228941A1
JPWO2023228941A1 JP2024523306A JP2024523306A JPWO2023228941A1 JP WO2023228941 A1 JPWO2023228941 A1 JP WO2023228941A1 JP 2024523306 A JP2024523306 A JP 2024523306A JP 2024523306 A JP2024523306 A JP 2024523306A JP WO2023228941 A1 JPWO2023228941 A1 JP WO2023228941A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024523306A
Other languages
Japanese (ja)
Other versions
JP7800676B2 (ja
JPWO2023228941A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023228941A1 publication Critical patent/JPWO2023228941A1/ja
Publication of JPWO2023228941A5 publication Critical patent/JPWO2023228941A5/ja
Application granted granted Critical
Publication of JP7800676B2 publication Critical patent/JP7800676B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/02Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/40Radiating elements coated with or embedded in protective material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/06Details
    • H01Q9/065Microstrip dipole antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H01Q9/285Planar dipole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Details Of Aerials (AREA)
JP2024523306A 2022-05-24 2023-05-23 電子部品モジュールおよびそれを備える無線通信デバイス Active JP7800676B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022084601 2022-05-24
JP2022084601 2022-05-24
JP2022118120 2022-07-25
JP2022118120 2022-07-25
PCT/JP2023/019147 WO2023228941A1 (ja) 2022-05-24 2023-05-23 電子部品モジュールおよびそれを備える無線通信デバイス

Publications (3)

Publication Number Publication Date
JPWO2023228941A1 true JPWO2023228941A1 (https=) 2023-11-30
JPWO2023228941A5 JPWO2023228941A5 (https=) 2025-01-10
JP7800676B2 JP7800676B2 (ja) 2026-01-16

Family

ID=88919377

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024523307A Pending JPWO2023228942A1 (https=) 2022-05-24 2023-05-23
JP2024523306A Active JP7800676B2 (ja) 2022-05-24 2023-05-23 電子部品モジュールおよびそれを備える無線通信デバイス

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2024523307A Pending JPWO2023228942A1 (https=) 2022-05-24 2023-05-23

Country Status (4)

Country Link
US (1) US20250055176A1 (https=)
JP (2) JPWO2023228942A1 (https=)
CN (1) CN223503080U (https=)
WO (2) WO2023228941A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107947A (ja) * 2006-10-24 2008-05-08 Toppan Printing Co Ltd Rfidタグ
JP2011156858A (ja) * 2010-01-08 2011-08-18 Hayakawa Rubber Co Ltd レーザー光を用いた接合方法
WO2020079962A1 (ja) * 2018-10-15 2020-04-23 株式会社村田製作所 無線通信デバイス
WO2020152915A1 (ja) * 2019-01-25 2020-07-30 株式会社村田製作所 無線通信デバイスおよびその製造方法
WO2021210535A1 (ja) * 2020-04-14 2021-10-21 株式会社村田製作所 無線通信デバイス製造システム
JP7264325B1 (ja) * 2021-07-02 2023-04-25 株式会社村田製作所 無線通信デバイス製造システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5196389B2 (ja) * 2006-03-23 2013-05-15 大阪シーリング印刷株式会社 Rfidラベル及びrfidラベルの製造方法
JP5939830B2 (ja) * 2012-02-21 2016-06-22 サトーホールディングス株式会社 Rfidタグ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107947A (ja) * 2006-10-24 2008-05-08 Toppan Printing Co Ltd Rfidタグ
JP2011156858A (ja) * 2010-01-08 2011-08-18 Hayakawa Rubber Co Ltd レーザー光を用いた接合方法
WO2020079962A1 (ja) * 2018-10-15 2020-04-23 株式会社村田製作所 無線通信デバイス
WO2020152915A1 (ja) * 2019-01-25 2020-07-30 株式会社村田製作所 無線通信デバイスおよびその製造方法
WO2021210535A1 (ja) * 2020-04-14 2021-10-21 株式会社村田製作所 無線通信デバイス製造システム
JP7081729B2 (ja) * 2020-04-14 2022-06-07 株式会社村田製作所 無線通信デバイス製造システム
JP7264325B1 (ja) * 2021-07-02 2023-04-25 株式会社村田製作所 無線通信デバイス製造システム

Also Published As

Publication number Publication date
CN223503080U (zh) 2025-10-31
JP7800676B2 (ja) 2026-01-16
JPWO2023228942A1 (https=) 2023-11-30
US20250055176A1 (en) 2025-02-13
WO2023228942A1 (ja) 2023-11-30
WO2023228941A1 (ja) 2023-11-30

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