JPWO2023223804A1 - - Google Patents
Info
- Publication number
- JPWO2023223804A1 JPWO2023223804A1 JP2024521649A JP2024521649A JPWO2023223804A1 JP WO2023223804 A1 JPWO2023223804 A1 JP WO2023223804A1 JP 2024521649 A JP2024521649 A JP 2024521649A JP 2024521649 A JP2024521649 A JP 2024521649A JP WO2023223804 A1 JPWO2023223804 A1 JP WO2023223804A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/01—Manufacture or treatment
- H10W40/03—Manufacture or treatment of arrangements for cooling
- H10W40/037—Assembling together parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022079918 | 2022-05-16 | ||
| JP2022079918 | 2022-05-16 | ||
| PCT/JP2023/016649 WO2023223804A1 (ja) | 2022-05-16 | 2023-04-27 | パワーモジュール、パワーモジュールの製造方法、および電力変換装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023223804A1 true JPWO2023223804A1 (https=) | 2023-11-23 |
| JPWO2023223804A5 JPWO2023223804A5 (https=) | 2024-08-22 |
| JP7678937B2 JP7678937B2 (ja) | 2025-05-16 |
Family
ID=88835017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024521649A Active JP7678937B2 (ja) | 2022-05-16 | 2023-04-27 | パワーモジュール、パワーモジュールの製造方法、および電力変換装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250246512A1 (https=) |
| JP (1) | JP7678937B2 (https=) |
| CN (1) | CN119183607A (https=) |
| WO (1) | WO2023223804A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025087361A (ja) * | 2023-11-29 | 2025-06-10 | Ａｓｔｅｍｏ株式会社 | パワー半導体装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011160519A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電力変換装置 |
| JP2016100940A (ja) * | 2014-11-19 | 2016-05-30 | 株式会社ケーヒン | 電力変換装置 |
| WO2018097027A1 (ja) * | 2016-11-24 | 2018-05-31 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2022158392A1 (ja) * | 2021-01-22 | 2022-07-28 | 三菱電機株式会社 | パワー半導体装置およびその製造方法ならびに電力変換装置 |
-
2023
- 2023-04-27 CN CN202380039817.7A patent/CN119183607A/zh active Pending
- 2023-04-27 WO PCT/JP2023/016649 patent/WO2023223804A1/ja not_active Ceased
- 2023-04-27 JP JP2024521649A patent/JP7678937B2/ja active Active
- 2023-04-27 US US18/856,188 patent/US20250246512A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011160519A (ja) * | 2010-01-29 | 2011-08-18 | Honda Motor Co Ltd | 電力変換装置 |
| JP2016100940A (ja) * | 2014-11-19 | 2016-05-30 | 株式会社ケーヒン | 電力変換装置 |
| WO2018097027A1 (ja) * | 2016-11-24 | 2018-05-31 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2022158392A1 (ja) * | 2021-01-22 | 2022-07-28 | 三菱電機株式会社 | パワー半導体装置およびその製造方法ならびに電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20250246512A1 (en) | 2025-07-31 |
| CN119183607A (zh) | 2024-12-24 |
| WO2023223804A1 (ja) | 2023-11-23 |
| JP7678937B2 (ja) | 2025-05-16 |
Similar Documents
Legal Events
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