JPWO2025094656A1 - - Google Patents
Info
- Publication number
- JPWO2025094656A1 JPWO2025094656A1 JP2025554628A JP2025554628A JPWO2025094656A1 JP WO2025094656 A1 JPWO2025094656 A1 JP WO2025094656A1 JP 2025554628 A JP2025554628 A JP 2025554628A JP 2025554628 A JP2025554628 A JP 2025554628A JP WO2025094656 A1 JPWO2025094656 A1 JP WO2025094656A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023187609 | 2023-11-01 | ||
| PCT/JP2024/036671 WO2025094656A1 (ja) | 2023-11-01 | 2024-10-15 | 半導体装置、半導体装置の製造方法、および電力変換装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025094656A1 true JPWO2025094656A1 (https=) | 2025-05-08 |
Family
ID=95581811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025554628A Pending JPWO2025094656A1 (https=) | 2023-11-01 | 2024-10-15 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025094656A1 (https=) |
| WO (1) | WO2025094656A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10150284A (ja) * | 1996-11-20 | 1998-06-02 | Yaskawa Electric Corp | 制御ユニット |
| WO2002049106A1 (fr) * | 2000-12-11 | 2002-06-20 | Fujitsu Limited | Module électronique |
| JP5089662B2 (ja) * | 2009-08-04 | 2012-12-05 | 三菱電機株式会社 | 半導体モジュール |
| US11152280B2 (en) * | 2016-11-24 | 2021-10-19 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
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2024
- 2024-10-15 WO PCT/JP2024/036671 patent/WO2025094656A1/ja active Pending
- 2024-10-15 JP JP2025554628A patent/JPWO2025094656A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025094656A1 (ja) | 2025-05-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251029 |