CN119183607A - 功率模块、功率模块的制造方法及电力变换装置 - Google Patents

功率模块、功率模块的制造方法及电力变换装置 Download PDF

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Publication number
CN119183607A
CN119183607A CN202380039817.7A CN202380039817A CN119183607A CN 119183607 A CN119183607 A CN 119183607A CN 202380039817 A CN202380039817 A CN 202380039817A CN 119183607 A CN119183607 A CN 119183607A
Authority
CN
China
Prior art keywords
main
terminal
power module
main terminal
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380039817.7A
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English (en)
Chinese (zh)
Inventor
滨田刚
后藤正喜
寺田隼人
六分一穗隆
增田羽香奈
三田泰之
森贞达志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN119183607A publication Critical patent/CN119183607A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

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  • Inverter Devices (AREA)
CN202380039817.7A 2022-05-16 2023-04-27 功率模块、功率模块的制造方法及电力变换装置 Pending CN119183607A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022079918 2022-05-16
JP2022-079918 2022-05-16
PCT/JP2023/016649 WO2023223804A1 (ja) 2022-05-16 2023-04-27 パワーモジュール、パワーモジュールの製造方法、および電力変換装置

Publications (1)

Publication Number Publication Date
CN119183607A true CN119183607A (zh) 2024-12-24

Family

ID=88835017

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380039817.7A Pending CN119183607A (zh) 2022-05-16 2023-04-27 功率模块、功率模块的制造方法及电力变换装置

Country Status (4)

Country Link
US (1) US20250246512A1 (https=)
JP (1) JP7678937B2 (https=)
CN (1) CN119183607A (https=)
WO (1) WO2023223804A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025087361A (ja) * 2023-11-29 2025-06-10 Ａｓｔｅｍｏ株式会社 パワー半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5550927B2 (ja) * 2010-01-29 2014-07-16 本田技研工業株式会社 電力変換装置
JP2016100940A (ja) * 2014-11-19 2016-05-30 株式会社ケーヒン 電力変換装置
US11152280B2 (en) * 2016-11-24 2021-10-19 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
CN116762170A (zh) * 2021-01-22 2023-09-15 三菱电机株式会社 功率半导体装置及其制造方法以及电力转换装置

Also Published As

Publication number Publication date
US20250246512A1 (en) 2025-07-31
JPWO2023223804A1 (https=) 2023-11-23
WO2023223804A1 (ja) 2023-11-23
JP7678937B2 (ja) 2025-05-16

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