JP7678937B2 - パワーモジュール、パワーモジュールの製造方法、および電力変換装置 - Google Patents

パワーモジュール、パワーモジュールの製造方法、および電力変換装置 Download PDF

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Publication number
JP7678937B2
JP7678937B2 JP2024521649A JP2024521649A JP7678937B2 JP 7678937 B2 JP7678937 B2 JP 7678937B2 JP 2024521649 A JP2024521649 A JP 2024521649A JP 2024521649 A JP2024521649 A JP 2024521649A JP 7678937 B2 JP7678937 B2 JP 7678937B2
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main
terminal
power module
main terminal
base
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JP2024521649A
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Japanese (ja)
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JPWO2023223804A5 (https=
JPWO2023223804A1 (https=
Inventor
剛 濱田
正喜 後藤
隼人 寺田
穂隆 六分一
羽香奈 増田
泰之 三田
達志 森貞
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

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  • Inverter Devices (AREA)
JP2024521649A 2022-05-16 2023-04-27 パワーモジュール、パワーモジュールの製造方法、および電力変換装置 Active JP7678937B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022079918 2022-05-16
JP2022079918 2022-05-16
PCT/JP2023/016649 WO2023223804A1 (ja) 2022-05-16 2023-04-27 パワーモジュール、パワーモジュールの製造方法、および電力変換装置

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JPWO2023223804A1 JPWO2023223804A1 (https=) 2023-11-23
JPWO2023223804A5 JPWO2023223804A5 (https=) 2024-08-22
JP7678937B2 true JP7678937B2 (ja) 2025-05-16

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JP2024521649A Active JP7678937B2 (ja) 2022-05-16 2023-04-27 パワーモジュール、パワーモジュールの製造方法、および電力変換装置

Country Status (4)

Country Link
US (1) US20250246512A1 (https=)
JP (1) JP7678937B2 (https=)
CN (1) CN119183607A (https=)
WO (1) WO2023223804A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025087361A (ja) * 2023-11-29 2025-06-10 Ａｓｔｅｍｏ株式会社 パワー半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011160519A (ja) 2010-01-29 2011-08-18 Honda Motor Co Ltd 電力変換装置
JP2016100940A (ja) 2014-11-19 2016-05-30 株式会社ケーヒン 電力変換装置
WO2018097027A1 (ja) 2016-11-24 2018-05-31 三菱電機株式会社 半導体装置およびその製造方法
WO2022158392A1 (ja) 2021-01-22 2022-07-28 三菱電機株式会社 パワー半導体装置およびその製造方法ならびに電力変換装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011160519A (ja) 2010-01-29 2011-08-18 Honda Motor Co Ltd 電力変換装置
JP2016100940A (ja) 2014-11-19 2016-05-30 株式会社ケーヒン 電力変換装置
WO2018097027A1 (ja) 2016-11-24 2018-05-31 三菱電機株式会社 半導体装置およびその製造方法
WO2022158392A1 (ja) 2021-01-22 2022-07-28 三菱電機株式会社 パワー半導体装置およびその製造方法ならびに電力変換装置

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Publication number Publication date
US20250246512A1 (en) 2025-07-31
JPWO2023223804A1 (https=) 2023-11-23
CN119183607A (zh) 2024-12-24
WO2023223804A1 (ja) 2023-11-23

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