JPWO2023218994A5 - - Google Patents
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- Publication number
- JPWO2023218994A5 JPWO2023218994A5 JP2024520400A JP2024520400A JPWO2023218994A5 JP WO2023218994 A5 JPWO2023218994 A5 JP WO2023218994A5 JP 2024520400 A JP2024520400 A JP 2024520400A JP 2024520400 A JP2024520400 A JP 2024520400A JP WO2023218994 A5 JPWO2023218994 A5 JP WO2023218994A5
- Authority
- JP
- Japan
- Prior art keywords
- styrene
- based resin
- mass
- resin composition
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 52
- 230000003287 optical effect Effects 0.000 claims 15
- 239000011342 resin composition Substances 0.000 claims 15
- 239000000178 monomer Substances 0.000 claims 11
- 150000001412 amines Chemical class 0.000 claims 9
- 239000004611 light stabiliser Substances 0.000 claims 9
- 229920001577 copolymer Polymers 0.000 claims 6
- 238000006068 polycondensation reaction Methods 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 3
- 238000009792 diffusion process Methods 0.000 claims 3
- UKJARPDLRWBRAX-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 UKJARPDLRWBRAX-UHFFFAOYSA-N 0.000 claims 3
- 229910052698 phosphorus Inorganic materials 0.000 claims 3
- 239000011574 phosphorus Substances 0.000 claims 3
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 claims 2
- -1 Bis(1,2,2,6,6-pentamethylpiperidin-4-yl) n-butyl 3,5-di-tert-butyl 4-hydroxybenzyl malonate Chemical compound 0.000 claims 2
- 239000003963 antioxidant agent Substances 0.000 claims 2
- 230000003078 antioxidant effect Effects 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 2
- YSSBODGKHOXDDC-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 YSSBODGKHOXDDC-UHFFFAOYSA-N 0.000 claims 1
- JMUOXOJMXILBTE-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 JMUOXOJMXILBTE-UHFFFAOYSA-N 0.000 claims 1
- NWHNXXMYEICZAT-UHFFFAOYSA-N 1,2,2,6,6-pentamethylpiperidin-4-ol Chemical compound CN1C(C)(C)CC(O)CC1(C)C NWHNXXMYEICZAT-UHFFFAOYSA-N 0.000 claims 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 claims 1
- JDLQSLMTBGPZLW-UHFFFAOYSA-N 1-(1-hydroxyethyl)-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC(O)N1C(C)(C)CC(O)CC1(C)C JDLQSLMTBGPZLW-UHFFFAOYSA-N 0.000 claims 1
- VDVUCLWJZJHFAV-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1 VDVUCLWJZJHFAV-UHFFFAOYSA-N 0.000 claims 1
- ZMVFVKHGEPJOQV-UHFFFAOYSA-N 2-methyl-2-(1,2,2,6,6-pentamethylpiperidin-4-yl)decanedioic acid Chemical group CN1C(C)(C)CC(C(C)(CCCCCCCC(O)=O)C(O)=O)CC1(C)C ZMVFVKHGEPJOQV-UHFFFAOYSA-N 0.000 claims 1
- UWRXMIQVSKQAIJ-UHFFFAOYSA-N 2-n-[3-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1h-triazin-2-yl]-[2-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1h-triazin-2-yl]-[3-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1h-triazin-2-yl]amino]propyl Chemical compound C=1C(N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)=NN(NCCCN(CCN(CCCNN2N=C(C=C(N2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N2N=C(C=C(N2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N2N=C(C=C(N2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)NC=1N(CCCC)C1CC(C)(C)N(C)C(C)(C)C1 UWRXMIQVSKQAIJ-UHFFFAOYSA-N 0.000 claims 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 claims 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 claims 1
- UQAMDAUJTXFNAD-UHFFFAOYSA-N 4-(4,6-dichloro-1,3,5-triazin-2-yl)morpholine Chemical compound ClC1=NC(Cl)=NC(N2CCOCC2)=N1 UQAMDAUJTXFNAD-UHFFFAOYSA-N 0.000 claims 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 claims 1
- OWXXKGVQBCBSFJ-UHFFFAOYSA-N 6-n-[3-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1,3,5-triazin-2-yl]-[2-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1,3,5-triazin-2-yl]-[3-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1,3,5-triazin-2-yl]ami Chemical compound N=1C(NCCCN(CCN(CCCNC=2N=C(N=C(N=2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)C=2N=C(N=C(N=2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)C=2N=C(N=C(N=2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)=NC(N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)=NC=1N(CCCC)C1CC(C)(C)N(C)C(C)(C)C1 OWXXKGVQBCBSFJ-UHFFFAOYSA-N 0.000 claims 1
- BJMZKHIKOPPZAM-UHFFFAOYSA-N 6-n-[6,11-bis[[4,6-bis[butyl-(2,2,6,6-tetramethylpiperidin-4-yl)amino]-1,3,5-triazin-2-yl]amino]undecyl]-2-n,4-n-dibutyl-2-n,4-n-bis(2,2,6,6-tetramethylpiperidin-4-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NCCCCCC(CCCCCNC=2N=C(N=C(N=2)N(CCCC)C2CC(C)(C)NC(C)(C)C2)N(CCCC)C2CC(C)(C)NC(C)(C)C2)NC=2N=C(N=C(N=2)N(CCCC)C2CC(C)(C)NC(C)(C)C2)N(CCCC)C2CC(C)(C)NC(C)(C)C2)=NC(N(CCCC)C2CC(C)(C)NC(C)(C)C2)=NC=1N(CCCC)C1CC(C)(C)NC(C)(C)C1 BJMZKHIKOPPZAM-UHFFFAOYSA-N 0.000 claims 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 claims 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims 1
- BEIOEBMXPVYLRY-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=CC(=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C BEIOEBMXPVYLRY-UHFFFAOYSA-N 0.000 claims 1
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 claims 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical group C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 claims 1
- ZEFSGHVBJCEKAZ-UHFFFAOYSA-N bis(2,4-ditert-butyl-6-methylphenyl) ethyl phosphite Chemical compound CC=1C=C(C(C)(C)C)C=C(C(C)(C)C)C=1OP(OCC)OC1=C(C)C=C(C(C)(C)C)C=C1C(C)(C)C ZEFSGHVBJCEKAZ-UHFFFAOYSA-N 0.000 claims 1
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 claims 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 claims 1
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 claims 1
- 229920000578 graft copolymer Polymers 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- FDAKZQLBIFPGSV-UHFFFAOYSA-N n-butyl-2,2,6,6-tetramethylpiperidin-4-amine Chemical compound CCCCNC1CC(C)(C)NC(C)(C)C1 FDAKZQLBIFPGSV-UHFFFAOYSA-N 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000001384 succinic acid Substances 0.000 claims 1
- NZNAAUDJKMURFU-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CC(=O)OC1CC(C)(C)NC(C)(C)C1 NZNAAUDJKMURFU-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022079368 | 2022-05-13 | ||
| JP2022079368 | 2022-05-13 | ||
| PCT/JP2023/016702 WO2023218994A1 (ja) | 2022-05-13 | 2023-04-27 | 光学用スチレン系樹脂組成物、導光板、エッジライト型面光源ユニット、光拡散版、及び直下型面光源ユニット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023218994A1 JPWO2023218994A1 (enrdf_load_stackoverflow) | 2023-11-16 |
| JPWO2023218994A5 true JPWO2023218994A5 (enrdf_load_stackoverflow) | 2024-09-12 |
| JP7606648B2 JP7606648B2 (ja) | 2024-12-25 |
Family
ID=88730388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024520400A Active JP7606648B2 (ja) | 2022-05-13 | 2023-04-27 | 光学用スチレン系樹脂組成物、導光板、エッジライト型面光源ユニット、光拡散版、及び直下型面光源ユニット |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7606648B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20250010660A (enrdf_load_stackoverflow) |
| CN (1) | CN119095909A (enrdf_load_stackoverflow) |
| MX (1) | MX2024013759A (enrdf_load_stackoverflow) |
| TW (1) | TW202346381A (enrdf_load_stackoverflow) |
| WO (1) | WO2023218994A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024141748A (ja) * | 2023-03-29 | 2024-10-10 | 東洋スチレン株式会社 | 光学部材用スチレン系樹脂組成物、光学部材、及び導光板 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003075648A (ja) * | 2001-09-07 | 2003-03-12 | Denki Kagaku Kogyo Kk | 導光板 |
| KR100771019B1 (ko) | 2002-03-20 | 2007-10-29 | 주식회사 만도 | 브레이크 액압제어장치 |
| JP2006154445A (ja) * | 2004-11-30 | 2006-06-15 | Denki Kagaku Kogyo Kk | 光拡散板 |
| JP2007224221A (ja) * | 2006-02-27 | 2007-09-06 | Denki Kagaku Kogyo Kk | 光学用成形体 |
| JP2007246810A (ja) * | 2006-03-17 | 2007-09-27 | Nippon A & L Kk | 光学用樹脂成形品およびそれからなる導光板、拡散板 |
| JP4863744B2 (ja) * | 2006-03-27 | 2012-01-25 | 電気化学工業株式会社 | 光学用成形体 |
| KR20090040293A (ko) * | 2006-07-19 | 2009-04-23 | 덴키 가가쿠 고교 가부시기가이샤 | 스티렌계 수지 조성물 및 성형체 |
| CN102093689A (zh) * | 2010-12-27 | 2011-06-15 | 金发科技股份有限公司 | 一种光散射功能母粒及其制备方法与应用 |
| KR102457996B1 (ko) * | 2015-02-12 | 2022-10-24 | 덴카 주식회사 | 광학용 스티렌계 수지 조성물 |
| WO2021039368A1 (ja) * | 2019-08-30 | 2021-03-04 | 東レ株式会社 | 透明熱可塑性樹脂組成物、その製造方法、透明熱可塑性樹脂組成物を成形してなる成形品および成形品の製造方法 |
| KR20220162743A (ko) * | 2020-04-01 | 2022-12-08 | 덴카 주식회사 | 광학용 스티렌계 수지 조성물, 도광판 및 에지라이트형 면 광원 유닛 |
-
2023
- 2023-04-27 KR KR1020247041392A patent/KR20250010660A/ko active Pending
- 2023-04-27 CN CN202380036124.2A patent/CN119095909A/zh active Pending
- 2023-04-27 WO PCT/JP2023/016702 patent/WO2023218994A1/ja active Application Filing
- 2023-04-27 JP JP2024520400A patent/JP7606648B2/ja active Active
- 2023-04-27 TW TW112115668A patent/TW202346381A/zh unknown
-
2024
- 2024-11-07 MX MX2024013759A patent/MX2024013759A/es unknown
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