JPWO2023218801A5 - - Google Patents
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- Publication number
- JPWO2023218801A5 JPWO2023218801A5 JP2024520293A JP2024520293A JPWO2023218801A5 JP WO2023218801 A5 JPWO2023218801 A5 JP WO2023218801A5 JP 2024520293 A JP2024520293 A JP 2024520293A JP 2024520293 A JP2024520293 A JP 2024520293A JP WO2023218801 A5 JPWO2023218801 A5 JP WO2023218801A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- hole conductor
- capacitor
- electrode layer
- capacitor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025086319A JP2025119022A (ja) | 2022-05-13 | 2025-05-23 | コンデンサ |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022079550 | 2022-05-13 | ||
| JP2022079550 | 2022-05-13 | ||
| PCT/JP2023/013955 WO2023218801A1 (ja) | 2022-05-13 | 2023-04-04 | コンデンサ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025086319A Division JP2025119022A (ja) | 2022-05-13 | 2025-05-23 | コンデンサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023218801A1 JPWO2023218801A1 (enExample) | 2023-11-16 |
| JPWO2023218801A5 true JPWO2023218801A5 (enExample) | 2024-12-19 |
| JP7732589B2 JP7732589B2 (ja) | 2025-09-02 |
Family
ID=88729998
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024520293A Active JP7732589B2 (ja) | 2022-05-13 | 2023-04-04 | コンデンサ |
| JP2025086319A Pending JP2025119022A (ja) | 2022-05-13 | 2025-05-23 | コンデンサ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025086319A Pending JP2025119022A (ja) | 2022-05-13 | 2025-05-23 | コンデンサ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250054705A1 (enExample) |
| JP (2) | JP7732589B2 (enExample) |
| CN (1) | CN119173972A (enExample) |
| TW (1) | TWI852528B (enExample) |
| WO (1) | WO2023218801A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI885959B (zh) * | 2023-07-28 | 2025-06-01 | 日商村田製作所股份有限公司 | 內建電容器之基板 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100494A (en) * | 1980-01-16 | 1981-08-12 | Fujitsu Ltd | Method of manufacturing printed circuit board |
| JPH07221458A (ja) * | 1994-01-27 | 1995-08-18 | Cmk Corp | 多層プリント配線板 |
| US5811868A (en) * | 1996-12-20 | 1998-09-22 | International Business Machines Corp. | Integrated high-performance decoupling capacitor |
| US6565730B2 (en) * | 1999-12-29 | 2003-05-20 | Intel Corporation | Self-aligned coaxial via capacitors |
| JP2001320171A (ja) | 2000-05-08 | 2001-11-16 | Shinko Electric Ind Co Ltd | 多層配線基板及び半導体装置 |
| JP4899775B2 (ja) | 2006-10-13 | 2012-03-21 | パナソニック株式会社 | 固体電解コンデンサの製造方法と固体電解コンデンサ内蔵基板の製造方法 |
| JP5157332B2 (ja) | 2007-09-05 | 2013-03-06 | 凸版印刷株式会社 | 多層配線板 |
| TWI345797B (en) | 2007-12-21 | 2011-07-21 | Ind Tech Res Inst | Hybrid capacitor |
| CN101673619B (zh) * | 2009-08-21 | 2012-10-03 | 上海宏力半导体制造有限公司 | 柱状电容器、堆叠型同轴柱状电容器及其制造方法 |
| TWI405322B (zh) | 2010-12-29 | 2013-08-11 | 財團法人工業技術研究院 | 內藏電容基板模組 |
| WO2017154167A1 (ja) | 2016-03-10 | 2017-09-14 | 三井金属鉱業株式会社 | 多層積層板及びこれを用いた多層プリント配線板の製造方法 |
| KR102140173B1 (ko) | 2018-10-25 | 2020-07-31 | 전자부품연구원 | 관통홀 구조를 갖는 캐패시터 및 그 제조방법 |
| JP7180561B2 (ja) * | 2019-03-29 | 2022-11-30 | 株式会社村田製作所 | コンデンサアレイ、及び、複合電子部品 |
| TWI780668B (zh) * | 2020-05-28 | 2022-10-11 | 日商村田製作所股份有限公司 | 用於半導體複合裝置之模組 |
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2023
- 2023-04-04 WO PCT/JP2023/013955 patent/WO2023218801A1/ja not_active Ceased
- 2023-04-04 CN CN202380039577.0A patent/CN119173972A/zh active Pending
- 2023-04-04 JP JP2024520293A patent/JP7732589B2/ja active Active
- 2023-05-03 TW TW112116473A patent/TWI852528B/zh active
-
2024
- 2024-10-30 US US18/931,804 patent/US20250054705A1/en active Pending
-
2025
- 2025-05-23 JP JP2025086319A patent/JP2025119022A/ja active Pending