JP7732589B2 - コンデンサ - Google Patents

コンデンサ

Info

Publication number
JP7732589B2
JP7732589B2 JP2024520293A JP2024520293A JP7732589B2 JP 7732589 B2 JP7732589 B2 JP 7732589B2 JP 2024520293 A JP2024520293 A JP 2024520293A JP 2024520293 A JP2024520293 A JP 2024520293A JP 7732589 B2 JP7732589 B2 JP 7732589B2
Authority
JP
Japan
Prior art keywords
layer
hole conductor
capacitor
conductor
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024520293A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023218801A1 (enExample
JPWO2023218801A5 (enExample
Inventor
章友 ▲高▼橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023218801A1 publication Critical patent/JPWO2023218801A1/ja
Publication of JPWO2023218801A5 publication Critical patent/JPWO2023218801A5/ja
Priority to JP2025086319A priority Critical patent/JP2025119022A/ja
Application granted granted Critical
Publication of JP7732589B2 publication Critical patent/JP7732589B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/06—Mounting in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/07—Dielectric layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2024520293A 2022-05-13 2023-04-04 コンデンサ Active JP7732589B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025086319A JP2025119022A (ja) 2022-05-13 2025-05-23 コンデンサ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022079550 2022-05-13
JP2022079550 2022-05-13
PCT/JP2023/013955 WO2023218801A1 (ja) 2022-05-13 2023-04-04 コンデンサ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025086319A Division JP2025119022A (ja) 2022-05-13 2025-05-23 コンデンサ

Publications (3)

Publication Number Publication Date
JPWO2023218801A1 JPWO2023218801A1 (enExample) 2023-11-16
JPWO2023218801A5 JPWO2023218801A5 (enExample) 2024-12-19
JP7732589B2 true JP7732589B2 (ja) 2025-09-02

Family

ID=88729998

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024520293A Active JP7732589B2 (ja) 2022-05-13 2023-04-04 コンデンサ
JP2025086319A Pending JP2025119022A (ja) 2022-05-13 2025-05-23 コンデンサ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025086319A Pending JP2025119022A (ja) 2022-05-13 2025-05-23 コンデンサ

Country Status (5)

Country Link
US (1) US20250054705A1 (enExample)
JP (2) JP7732589B2 (enExample)
CN (1) CN119173972A (enExample)
TW (1) TWI852528B (enExample)
WO (1) WO2023218801A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI885959B (zh) * 2023-07-28 2025-06-01 日商村田製作所股份有限公司 內建電容器之基板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001320171A (ja) 2000-05-08 2001-11-16 Shinko Electric Ind Co Ltd 多層配線基板及び半導体装置
JP2008098487A (ja) 2006-10-13 2008-04-24 Matsushita Electric Ind Co Ltd 固体電解コンデンサおよび固体電解コンデンサ内蔵基板と、それらの製造方法
JP2009064869A (ja) 2007-09-05 2009-03-26 Toppan Printing Co Ltd 多層配線板及びその製造方法
US20090161298A1 (en) 2007-12-21 2009-06-25 Industrial Technology Research Institute Hybrid capacitor
US20120168217A1 (en) 2010-12-29 2012-07-05 Industrial Technology Research Institute Embedded capacitor substrate module
WO2017154167A1 (ja) 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
US20200137889A1 (en) 2018-10-25 2020-04-30 Korea Electronics Technology Institute Capacitor having through hole structure and manufacturing method therefor
JP2020167361A (ja) 2019-03-29 2020-10-08 株式会社村田製作所 コンデンサアレイ、及び、複合電子部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100494A (en) * 1980-01-16 1981-08-12 Fujitsu Ltd Method of manufacturing printed circuit board
JPH07221458A (ja) * 1994-01-27 1995-08-18 Cmk Corp 多層プリント配線板
US5811868A (en) * 1996-12-20 1998-09-22 International Business Machines Corp. Integrated high-performance decoupling capacitor
US6565730B2 (en) * 1999-12-29 2003-05-20 Intel Corporation Self-aligned coaxial via capacitors
CN101673619B (zh) * 2009-08-21 2012-10-03 上海宏力半导体制造有限公司 柱状电容器、堆叠型同轴柱状电容器及其制造方法
TWI780668B (zh) * 2020-05-28 2022-10-11 日商村田製作所股份有限公司 用於半導體複合裝置之模組

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001320171A (ja) 2000-05-08 2001-11-16 Shinko Electric Ind Co Ltd 多層配線基板及び半導体装置
JP2008098487A (ja) 2006-10-13 2008-04-24 Matsushita Electric Ind Co Ltd 固体電解コンデンサおよび固体電解コンデンサ内蔵基板と、それらの製造方法
JP2009064869A (ja) 2007-09-05 2009-03-26 Toppan Printing Co Ltd 多層配線板及びその製造方法
US20090161298A1 (en) 2007-12-21 2009-06-25 Industrial Technology Research Institute Hybrid capacitor
US20120168217A1 (en) 2010-12-29 2012-07-05 Industrial Technology Research Institute Embedded capacitor substrate module
WO2017154167A1 (ja) 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
US20200137889A1 (en) 2018-10-25 2020-04-30 Korea Electronics Technology Institute Capacitor having through hole structure and manufacturing method therefor
JP2020167361A (ja) 2019-03-29 2020-10-08 株式会社村田製作所 コンデンサアレイ、及び、複合電子部品

Also Published As

Publication number Publication date
CN119173972A (zh) 2024-12-20
TW202347378A (zh) 2023-12-01
US20250054705A1 (en) 2025-02-13
WO2023218801A1 (ja) 2023-11-16
JPWO2023218801A1 (enExample) 2023-11-16
JP2025119022A (ja) 2025-08-13
TWI852528B (zh) 2024-08-11

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